2N6400 Series
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
Designed primarily for half-wave ac control applications, such as
motor controls, heating controls and power supplies; or wherever
half−wave silicon gate−controlled, solid−state devices are needed.
http://onsemi.com
Features
SCRs
16 AMPERES RMS
50 thru 800 VOLTS
• Glass Passivated Junctions with Center Gate Geometry for Greater
Parameter Uniformity and Stability
• Small, Rugged, Thermowatt Construction for Low Thermal
Resistance, High Heat Dissipation and Durability
• Blocking Voltage to 800 V
G
A
K
• These are Pb−Free Devices
MAXIMUM RATINGS* (T = 25°C unless otherwise noted)
J
MARKING
DIAGRAM
Rating
Symbol
Value
Unit
Peak Repetitive Off−State Voltage (Note 1)
J
V
V
V
DRM,
4
(T = *40 to 125°C, Sine Wave 50 to 60
RRM
Hz; Gate Open)
2N6400
50
100
200
400
600
800
2N6401
TO−220AB
CASE 221A
STYLE 3
2N640xG
AYWW
2N6402
2N6403
2N6404
2N6405
1
On-State Current RMS (180° Conduction
I
16
A
A
A
T(RMS)
Angles; T = 100°C)
2
C
3
Average On-State Current (180° Conduc-
I
T(AV)
10
tion Angles; T = 100°C)
C
x
= 0, 1, 2, 3, 4 or 5
Peak Non-repetitive Surge Current (1/2
I
160
TSM
A
Y
WW
G
= Assembly Location
= Year
= Work Week
Cycle, Sine Wave 60 Hz, T = 25°C)
J
2
2
Circuit Fusing Considerations (t = 8.3 ms)
I t
145
20
A s
= Pb−Free Package
Forward Peak Gate Power (Pulse Width ≤
P
W
W
A
GM
1.0 ms, T = 100°C)
C
Forward Average Gate Power (t = 8.3 ms,
P
0.5
2.0
G(AV)
PIN ASSIGNMENT
Cathode
T
C
= 100°C)
1
2
3
4
Forward Peak Gate Current (Pulse Width ≤
I
GM
Anode
1.0 ms, T = 100°C)
C
Gate
Operating Junction Temperature Range
Storage Temperature Range
T
J
−40 to
+125
°C
°C
Anode
T
stg
−40 to
+150
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. V
and V
for all types can be applied on a continuous basis. Ratings
DRM
RRM
apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
November, 2012 − Rev. 6
2N6400/D