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2N2605 PDF预览

2N2605

更新时间: 2024-11-19 22:35:51
品牌 Logo 应用领域
SEMICOA 晶体晶体管
页数 文件大小 规格书
1页 33K
描述
Chip Type 2C2605 Geometry 0220 Polarity NPN

2N2605 技术参数

生命周期:Contact Manufacturer零件包装代码:TO-46
包装说明:CYLINDRICAL, O-MBCY-W3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.21.00.95风险等级:5.14
Is Samacsys:N最大集电极电流 (IC):0.03 A
集电极-发射极最大电压:60 V配置:SINGLE
最小直流电流增益 (hFE):100JEDEC-95代码:TO-46
JESD-30 代码:O-MBCY-W3元件数量:1
端子数量:3最高工作温度:200 °C
封装主体材料:METAL封装形状:ROUND
封装形式:CYLINDRICAL极性/信道类型:PNP
最大功率耗散 (Abs):0.4 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:NO
端子形式:WIRE端子位置:BOTTOM
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
标称过渡频率 (fT):30 MHzBase Number Matches:1

2N2605 数据手册

  
Data Sheet No. 2C2605  
Ge ne ric Pa c ka ge d Pa rts :  
Chip Type 2C2605  
Geometry 0220  
Polarity NPN  
2N2604, 2N2605, 2N3798,  
2N3799, 2N3810, 2N3811  
Chip type 2C2605 by Semicoa Semi-  
conductors provides performance  
similar to these devices.  
Product Summary:  
APPLICATIONS: Designed for high  
speed switching applications.  
Part Numbers:  
2N2604, 2N2605, 2N3789, 2N3799, 2N3810,  
2N3811  
Features:  
·
High speed switching capabilities  
Mechanical Specifications  
Top  
Backside  
Emitter  
Base  
Al - 19.5 kÅ min.  
Metallization  
Au - 6.5 kÅ nom.  
3.6 mils diameter  
2.5 mils diameter  
Bonding Pad Size  
8 mils nominal  
Die Thickness  
Chip Area  
18 mils x 18 mils  
Silox Passivated  
Top Surface  
Electrical Characteristics  
TA = 25oC  
Parameter  
Test conditions  
IC = 10.0 A, IB = 0  
Min  
60  
Max  
---  
Unit  
V dc  
V dc  
V dc  
nA  
BVCEO  
BVCBO  
BVEBO  
ICBO  
IC = 10 µA, IE = 0  
70  
---  
IE = 10 µA, IC = 0  
6.0  
---  
---  
VCB = 60 Vc, IE = 0  
10  
hFE  
IC = 500 µA dc, VCE = 5.0 V  
150  
450  
---  
Due to limitations of probe testing, only dc parameters are tested. This must be done with pulse width less  
than 300 µs, duty cycle less than 2%.  

2N2605 替代型号

型号 品牌 替代类型 描述 数据表
2N2605 MICROSEMI

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