Datasheet > 2MX10-029-0510

2MX10-029-0510

更新时间： 2024-11-04 12:52:19

品牌	Logo	应用领域
RMT		/
页数	文件大小	规格书
7页	1685K
描述
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper

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数据手册

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2MX10-029-0510 数据手册

Thermoelectric Cooling Solutions

Performance Parameters

2MX10-029-XX

ΔT_maxQ_max

I_max

U_maxAC R

Type

Ohm mm

2MX10-029-xx (N=29)

2MX10-029-0510

2MX10-029-0816

5.6

3.8

6.0

4.0

0.33

0.50

3.2

4.1

2.4

Performance data are given for 300K, vacuum

Dimensions

Manufacturing options

A. TEC Assembly:

C. Ceramics Surface Options:

D. Thermistor (optional)

* 1. Solder SnSb (T_melt=230°C)

2. Solder AuSn (T_melt=280°C)

1. Blank ceramics (not metallized)

2. Metallized (Au plating)

Can be mounted to cold side

ceramics edge. Calibration is

available by request.

3. Metallized and pre-tinned with:

3.1 Solder 117 (In-Sn, T_melt=117°C)

3.2 Solder 138 (Sn-Bi, T_melt= 138°C)

3.3 Solder 143 (In-Ag, T_melt= 143°C)

B. Ceramics:

E. Terminal contacts

1. Blank, tinned Copper

2. Insulated Wires

* 1.Pure Al₂O₃(100%)

2.Alumina (Al₂O₃- 96%)

3.Aluminum Nitride (AlN)

* - used by default

3.4 Solder 157 (In, T_melt= 157°C)

3.5 Solder 183 (Pb-Sn, T_melt=183°C)

3.6 Optional (speciﬁed by Customer)

3. Insulated, color coded

46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru

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