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2MD04-014-08 PDF预览

2MD04-014-08

更新时间: 2024-11-25 12:26:55
品牌 Logo 应用领域
RMT /
页数 文件大小 规格书
8页 2368K
描述
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper

2MD04-014-08 数据手册

 浏览型号2MD04-014-08的Datasheet PDF文件第2页浏览型号2MD04-014-08的Datasheet PDF文件第3页浏览型号2MD04-014-08的Datasheet PDF文件第4页浏览型号2MD04-014-08的Datasheet PDF文件第5页浏览型号2MD04-014-08的Datasheet PDF文件第6页浏览型号2MD04-014-08的Datasheet PDF文件第7页 
Thermoelectric Cooling Solutions  
Performance Parameters  
2MD04-014-XX  
ΔTmax Qmax  
Imax  
A
Umax AC R  
H
Type  
K
W
V
Ohm mm  
2MD04-014-xx (N=14)  
2MD04-014-05  
2MD04-014-08  
2MD04-014-10  
2MD04-014-12  
2MD04-014-15  
96  
97  
97  
97  
97  
0.47  
0.30  
0.24  
0.20  
0.16  
1.2  
0.8  
0.6  
0.5  
0.4  
0.88  
1.40  
1.75  
2.09  
2.61  
2.0  
2.6  
3.0  
3.4  
4.0  
1.3  
Performance data are given for 300K, vacuum  
Dimensions  
Manufacturing options  
A. TEC Assembly:  
C. Ceramics Surface Options:  
D. Thermistor (optional)  
* 1. Solder SnSb (Tmelt=230°C)  
2. Solder AuSn (Tmelt=280°C)  
1. Blank ceramics (not metallized)  
2. Metallized (Au plating)  
Can be mounted to cold side  
ceramics edge. Calibration is  
available by request.  
3. Metallized and pre-tinned with:  
3.1 Solder 117 (In-Sn, Tmelt =117°C)  
3.2 Solder 138 (Sn-Bi, Tmelt = 138°C)  
3.3 Solder 143 (In-Ag, Tmelt = 143°C)  
B. Ceramics:  
E. Terminal contacts  
1. Blank, tinned Copper  
2. Insulated Wires  
* 1.Pure Al2O3(100%)  
2.Alumina (Al2O3- 96%)  
3.Aluminum Nitride (AlN)  
* - used by default  
3.4 Solder 157 (In, Tmelt = 157°C)  
3.5 Solder 183 (Pb-Sn, Tmelt =183°C)  
3.6 Optional (specified by Customer)  
3. Insulated, color coded  
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru  
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.  
Page 1 of 8  

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