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2MBI300UB-060 PDF预览

2MBI300UB-060

更新时间: 2024-11-06 19:38:35
品牌 Logo 应用领域
富士电机 - FUJI
页数 文件大小 规格书
5页 87K
描述
Insulated Gate Bipolar Transistor,

2MBI300UB-060 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:unknown风险等级:5.72
Base Number Matches:1

2MBI300UB-060 数据手册

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T-series and U-series IGBT  
Modules (600 V)  
Seiji Momota  
Syuuji Miyashita  
Hiroki Wakimoto  
1. Introduction  
for the above new IGBT modules. This paper presents  
these device techniques and the product series.  
The IGBT (insulated gate bipolar transistor) mod-  
ule is the most popular power device in power electron-  
ics fields such as motor control applications. The  
reason for the IGBT’s popularity is the market values  
of its excellent reliability due to reduction of generated  
loss and increase of withstand capability, etc., in  
addition to the fact that it can be easily driven. The  
600 V IGBT modules play an especially important role  
as key devices in a wide market area including the  
Japanese domestic market where 220 V industrial  
power supplies are used and overseas such as in  
Europe where 200 V public power supplies are used as  
general-purpose power supplies.  
Under these circumstances, Fuji Electric has also  
been developing a 600 V IBGT module product series,  
and has continued to improve their characteristics ever  
since first developing the series in 1988. In 2001, the  
development of thin wafer processing technology en-  
abled NPT (non-punch through) structure to be applied  
to 600 V devices. This made possible the development  
of T-series IGBTs, having low switching loss and being  
especially suitable for high frequency applications.  
While development of NPT technology mainly  
involved by development of the structure at the back of  
the chip, improvements of the chip’s front structure  
have also been implemented since 2002. By applying  
trench-gate-structure, increase in channel density and  
elimination of the unnecessary voltage-drop component  
was achieved, thereby enabling the reduction of on-  
state loss. This made the development of U-series  
IGBTs successful, as the device having the smallest  
loss among products of its class, and at present, we are  
in the process of producing various rated current series  
and sample modules.  
2. T-series IGBT Modules  
2.1 Features and challenges of T-series IGBT modules  
The cell structure of an NPT-type IGBT and the  
unit cell of PT (punch-through)-type device are shown  
in Fig. 1. Their features are as follows:  
(1) Since injection from the collector-side can be  
suppressed, lifetime control is unnecessary and  
the switching loss does not increase even at a high  
temperature.  
(2) Because the temperature dependence of output  
characteristics is positive (the saturation voltage  
increases at higher temperatures), these devices  
are well suited for parallel applications.  
(3) Withstand capability including load short-circuit  
capacity are higher than those of a PT-type device.  
(4) Use of an FZ (floating zone) wafer makes the price  
cheap and the reliability high owing to its low  
crystal defects.  
The challenge is to establish a thin wafer process-  
ing technique. It is important for NPT-type devices to  
suppress saturation voltage while maintaining the  
collector-emitter (CE) forward blocking voltage. This  
Fig.1 Comparison of unit cell structures  
G
E
G
E
n
-
n
-
n+  
p+  
C
p+  
For the FWD (free wheeling diode) packed in IGBT  
modules, enhanced soft-recovery characteristics as well  
as decreased loss is demanded. These demands are not  
only for the sake of preventing equipment malfunction,  
but also to preventing possible ill effects of noise  
emission on the surrounding equipment and on the  
human body. To satisfy these requirements, FWDs  
having a new structure were developed and adopted  
C
(a) PT-type IGBT  
(b) NPT-type IGBT  
110  

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