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2MBI300U4N-170-50 PDF预览

2MBI300U4N-170-50

更新时间: 2024-11-06 07:28:07
品牌 Logo 应用领域
富士电机 - FUJI 晶体晶体管功率控制双极性晶体管局域网
页数 文件大小 规格书
6页 580K
描述
IGBT MODULE

2MBI300U4N-170-50 技术参数

生命周期:Obsolete零件包装代码:MODULE
包装说明:FLANGE MOUNT, R-XUFM-X11针数:11
Reach Compliance Code:unknown风险等级:5.84
Is Samacsys:N外壳连接:ISOLATED
最大集电极电流 (IC):450 A集电极-发射极最大电压:1700 V
配置:SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR门极-发射极最大电压:20 V
JESD-30 代码:R-XUFM-X11元件数量:2
端子数量:11最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):1385 W认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子形式:UNSPECIFIED端子位置:UPPER
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):550 ns标称接通时间 (ton):620 ns
VCEsat-Max:2.9 VBase Number Matches:1

2MBI300U4N-170-50 数据手册

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2MBI300U4N-170-50  
IGBT MODULE (U series)  
IGBT Modules  
1700V / 300A / 2 in one package  
Features  
High speed switching  
Voltage drive  
Low Inductance module structure  
Applications  
Inverter for Motor Drive  
AC and DC Servo Drive Amplifier  
Uninterruptible Power Supply  
Industrial machines, such as Welding machines  
Maximum Ratings and Characteristics  
Absolute Maximum Ratings (at Tc=25°C unless otherwise specified)  
Items  
Symbols  
Conditions  
Maximum ratings  
Units  
Collector-Emitter voltage  
Gate-Emitter voltage  
V
CES  
1700  
±20  
V
V
VGES  
Tc=25°C  
Tc=80°C  
Tc=25°C  
Tc=80°C  
450  
300  
900  
600  
Ic  
Continuous  
1ms  
Collector current  
Icp  
A
-Ic  
300  
-Ic pulse  
Pc  
Tj  
1ms  
1 device  
600  
1385  
150  
Collector power dissipation  
Junction temperature  
Storage temperature  
W
°C  
Tstg  
-40 to +125  
between terminal and copper base (*1)  
between thermistor and others (*2)  
Mounting (*3)  
Isolation voltage  
Screw torque  
V
iso  
AC : 1min.  
3400  
VAC  
N m  
3.5  
4.5  
-
Terminals (*4)  
Note *1: All terminals should be connected together when isolation test will be done.  
Note *2: Two thermistor terminals should be connected together, each other terminals should be connected together and shorted to base plate when isolation test will be done.  
Note *3: Recommendable value : Mounting : 2.5-3.5 Nm (M5) Note *4: Recommendable value : Terminals : 3.5-4.5 Nm (M6)  
Electrical characteristics (at Tj= 25°C unless otherwise specified)  
Characteristics  
Items  
Symbols  
Conditions  
Units  
min.  
-
-
4.5  
-
-
-
typ.  
-
-
max.  
3.0  
600  
8.5  
2.90  
-
Zero gate voltage collector current  
Gate-Emitter leakage current  
Gate-Emitter threshold voltage  
I
I
V
CES  
GES  
V
V
V
GE = 0V, VCE = 1700V  
CE = 0V, VGE = ±20V  
mA  
nA  
V
GE (th)  
CE = 20V, I  
C
= 300mA  
6.5  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
2.70  
3.10  
2.30  
2.65  
28  
V
CE (sat)  
(terminal)  
V
GE = 15V  
= 300A  
Collector-Emitter saturation voltage  
V
I
C
2.45  
-
VCE (sat)  
(chip)  
Cies  
ton  
tr  
tr (i)  
toff  
tf  
-
-
Input capacitance  
Turn-on time  
V
CE = 10V, VGE = 0V, f = 1MHz  
CC = 900V  
-
nF  
-
-
-
-
-
-
-
-
0.62  
0.39  
0.05  
0.55  
0.09  
2.10  
2.30  
1.80  
2.00  
0.18  
1.00  
5000  
495  
3375  
1.20  
0.60  
-
1.50  
0.30  
2.40  
-
V
I
C
= 300A  
µs  
V
VGE = ±15V  
R = 1.5Ω  
G
Turn-off time  
V
F
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
(terminal)  
VF  
(chip)  
V
GE = 0V  
= 300A  
Forward on voltage  
I
F
1.95  
-
-
-
-
Reverse recovery time  
trr  
I
F
= 300A  
0.6  
-
-
µs  
mΩ  
Lead resistance, terminal-chip (*5)  
R lead  
T=25°C  
T=100°C  
T=25/50°C  
-
Resistance  
R
B
K
465  
3305  
520  
3450  
B value  
Note *5: Biggest internal terminal resistance among arm.  
Thermal resistance characteristics  
Items  
Characteristics  
Symbols  
Conditions  
Units  
min.  
typ.  
max.  
IGBT  
FWD  
-
-
-
-
-
0.09  
0.15  
-
Thermal resistance (1device)  
Rth(j-c)  
Rth(c-f)  
°C/W  
Contact thermal resistance (1device) (*6)  
with Thermal Compound  
0.0167  
Note *6: This is the value which is defined mounting on the additional cooling fin with thermal compound.  
1

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