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2KK6004DFN PDF预览

2KK6004DFN

更新时间: 2024-10-15 18:09:35
品牌 Logo 应用领域
科信 - KEXIN /
页数 文件大小 规格书
7页 283K
描述
N-Channel MOSFET

2KK6004DFN 数据手册

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SMD Type  
MOSFET  
N-Channel MOSFET  
2KK6004DFN  
Ƶ Features  
DFN5x6-8(PDFNWB5x6-8L)  
ƽ VDS (V) = 200 V  
ƽ
IDMAX (at VGS = 10 V) = 20.2 A  
ƽ RDS(ON) (at VGS = 10 V) < 50.5 mȍ  
ƽ RDS(ON) (at VGS = 7.5 V) < 53.5 mȍ  
S
D
D
D
D
S
S
G
Ƶ Absolute Maximum Ratings (T = 25ć unless otherwise noted)  
A
PARAMETER  
SYMBOL  
LIMIT  
200  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
V
± 20  
20.2  
16.1  
6.2 b, c  
5.0 b, c  
50  
T
C = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
Pulsed Drain Current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
TA = 25 °C  
24  
4.5 b, c  
Continuous Source-Drain Diode Current  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
IAS  
20  
L = 0.1 mH  
EAS  
20  
mJ  
W
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
52  
33  
Maximum Power Dissipation  
PD  
5 b, c  
3.2 b, c  
-55 to +150  
260  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak temperature) d, e  
TJ, Tstg  
°C  
Ƶ Thermal resistance ratings  
PARAMETER  
SYMBOL  
RthJA  
TYPICAL  
20  
MAXIMUM  
UNIT  
°C/W  
b, f  
Maximum Junction-to-Ambient  
t 10 s  
25  
Maximum Junction-to-Case (Drain)  
Steady State  
RthJC  
1.9  
2.4  
Notes  
a. Package limited.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
(not plated) as a result of the singulation process in  
This is a leadless package. The end of the lead terminal is exposed copper  
d.  
required to ensure adequate bottom  
nteed and is not  
manufacturing. A solder fillet at the exposed copper tip cannot be guara  
side solder  
interconnection.  
e. Rework conditions: manual soldering with a solderin g iron is not recommended for leadless components.  
f. Maximum under steady stat e conditions is 65 °C/W.  
g. TC = 25 °C.  
1
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