SMD Type
MOSFET
N-Channel MOSFET
2KK5100DFN
PDFN3.3x3.3-8
■ Features
Top View
Bottom View
● VDS = 40 V
●
ID (at VGS=10V) =40 A
● RDS(ON) (at VGS = 10 V) < 8.5 mΩ
● RDS(ON) (at VGS = 4.5 V) < 14.5 mΩ
Pin 1
Top View
S
D
D
D
D
1
2
3
4
8
7
6
5
S
S
G
■ Absolute Maximum Ratings (T
A
= 25℃ unless otherwise noted)
Parameter
Drain-Source Voltage
Symbol
Rating
40
Unit
V
V
V
DS
GS
Gate-Source Voltage
±20
40
T
C
= 25℃
Continuous Drain Current (Note 1)
Pulsed Drain Current (Note 2)
ID
A
TC
= 100℃
31
I
DM
AS
AS
100
40
Single Pulse Avalanche Current (Note 2)
I
A
Single Pulse Avalanche Energy L = 0.1mH (Note 2)
E
80
mJ
Thermal Resistance, Junction- to-Ambient (Note3, 4)
Thermal Resistance, Junction- to-Case
R
θJA
θJC
40
℃/W
W
R
3.4
36.7
14
T
C
= 25℃
= 100℃
= 25℃
= 70℃
Power Dissipation (Note 4)
Power Dissipation (Note 5)
PD
T
C
T
A
3.1
2
P
DSM
T
A
Junction Temperature
T
J
150
℃
Storage Temperature Range
Notes:
Tstg
-55 to 150
1. The maximum current rating is package limited.
2. Single pulse width limited by junction temperature TJ(MAX)=150°C.
3. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.
4. The power dissipation P is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in
setting the upper dissipation limit for cases where additional heatsinking is used.
5. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with
=25°C. The Power dissipation PDSM is based on RθJA t≤ 10s and the maximum allowed junction temperature of 150°C.
The value in any given application depends on the user's specific board design.
D
TA
1
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