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2KK5075DFN PDF预览

2KK5075DFN

更新时间: 2024-10-15 18:09:43
品牌 Logo 应用领域
科信 - KEXIN /
页数 文件大小 规格书
5页 915K
描述
N-Channel MOSFET

2KK5075DFN 数据手册

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SMD Type  
MSFET  
N-Channel MOSFET  
2KK5075DFN  
PDFN5x6-8  
Features  
VDS = 30 V  
ID (at VGS=10V) =36 A  
RDS(ON) (at VGS = 10 V) < 3.6 mΩ  
RDS(ON) (at VGS = 4.5 V) < 4.7 mΩ  
S
D
D
D
S
S
G
Absolute Maximum Ratings (T  
A
= 25unless otherwise noted)  
Parameter  
Drain-Source Voltage  
Symbol  
Rating  
30  
Unit  
V
V
V
DS  
GS  
Gate-Source Voltage  
±20  
36  
Continuous Drain Current (Note 1
Pulsed Drain Current (Note 2)  
TC  
= 25℃  
ID  
A
I
DM  
AS  
AS  
144  
40  
Single Pulse Avalanche Current (Note 2)  
I
A
Single Pulse Avalanche Energy L = 0.1H (Note 2)  
E
80  
mJ  
Thermal Resistance, Junction- to-Ambient (Note3, 4)  
Thermal Resistance, Junction- to-Case  
R
θJA  
θJC  
55  
/W  
W
R
2.5  
T
C
= 25℃  
= 100℃  
= 25℃  
= 70℃  
50  
Power Dissipation (Note 4)  
Power Dissipation (Note 5)  
PD  
T
C
20  
T
A
6.2  
P
DSM  
T
A
4
Junction Temperature  
T
J
150  
-55 to 150  
Storage Temperature Range  
Notes:  
Tstg  
1. The maximum current rating is package limited.  
2. Single pulse width limited by junction temperature TJ(MAX)=150°C.  
3. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.  
4. The power dissipation P is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in  
setting the upper dissipation limit for cases where additional heatsinking is used.  
5. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with  
=25°The Power dissipation PDSM is based on RθJA t10s and the maximum allowed junction temperature of 150°C.  
The value in y given application depends on the user's specific board design.  
D
TA  
1
www.kexin.com.cn  

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