SMD Type
MOSFET
N-Channel Enhancement MOSFET
Features
3
Low On-Resistance: RDS(ON)
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
1
2
Low Input/Output Leakage
ESD Protected 2KV HBM
Absolute Maximum Ratings Ta=25
Parameter
Symbol
VDS
Rating
60
Unit
V
Drain-Source Voltage
Gate-Source Voltage -Continuous
VGS
±20
Drain Current
-Continuous ( Note:1)
-Pulsed
440
ID
mA
1000
530
Power Dissipation
(Note 1)
PD
RthJA
TJ
mW
/W
Thermal Resistance.Junction- to-Ambient
Junction Temperature
232
150
Storage Temperature Range
Tstg
-55 to 150
Device mounted on FR-4 PCB using 1 square inch pad size, 1oz copper.
Notes: 1.
Electrical Characteristics Ta = 25
Parameter
Symbol
Test Conditions
D=100 A, VGS=0V
Min
60
Typ
Max
Unit
V
Drain-Source Breakdown Voltage (Note.2)
Zero Gate Voltage Drain Current (Note.2)
V
DSS
DSS
GSS
GS(th)
I
I
V
V
V
V
V
V
DS=60V, VGS=0V
DS=0V, VGS=±20V
1
A
V
Gate-Body Leakage Current
Gate Threshold Voltage
(Note.2)
(Note.2)
I
10
V
1
1.4
1.4
1.7
2.0
2.0
2.6
DS=VGS , I
GS=10V, I
V, I
GS=10V, I
D
=250
A
D
=500mA
Static Drain-Source On-Resistance (Note.2)
RDS(On)
GS=
D= 0 mA
Forward Transfer Admittance
Input Capacitance
(Note.2)
| Yfs |
iss
D
=200mA
80
ms
pF
C
50
25
5
V
V
GS=0V, VDS=25V, f=1MHz
Output Capacitance
C
oss
rss
Reverse Transfer Capacitance
Total Gate Charge
C
Qg
GS=4.5V, VDS=15V, I
=200mA, VDS=30V,
D=200mA
0.8
20
40
nC
ns
Turn-On DelayTime
t
d(on)
d(off)
I
D
RG=10 ,VGEN=10V,RL=150
Turn-Off DelayTime
t
Note: 2.
Short duration test pulse used to minimize self-heating effect.
Marking
Marking
1
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