Datasheet > 2982-2241-00

2982-2241-00

更新时间： 2024-09-22 23:19:39

品牌	Logo	应用领域
其他 - ETC		连接器
页数	文件大小	规格书
8页	179K
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OSMP Microminiature Push-On Coaxial Connectors

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2982-2241-00 数据手册

ID 1020

V3.00

OSMP Microminiature

Push-On Coaxial Connectors

• Intermateable with Gilbert GPO™ Series

• DESC approved

• Enhanced performance features

• Simplified Assembly

M/A-COM’s OSMP microminiature push-on coaxial connectors

provide solutions for today’s modular designs with denser pack-

aging requirements. The extremely small size of the OSMP

offers a versatile solution for high density packaging allowing

connector center-to-center spacing of 0.170". The push-on

interface facilitates easier assembly and test with a positive

snap-in feature to indicate a fully mated connection. The rugged

OSMP interface can withstand harsh environments of mechani-

cal shock and vibration, typically found in military or aerospace

related applications. M/A-COM’s OSMP connector interface is

the standard used by Defense Electronics Supply Center

(DESC) to generate the SMP push-on connector series.

OSMP Shroud and Jack to Jack Adapter Assembly

OSMP connectors can be your design solution for mechanical

packaging and frequency response. The OSMP interface pro-

vides 0.020" of radial misalignment for critical blindmate applica-

tions. Mating forces are strictly controlled to ensure reliable

connections per mated pair or when simultaneouslymating mul-

tiple connectors. Cable jacks include an anti-rocking ring to

ensure reliable mechanical performance regardless of the oper-

ating environment. OSMP connectors offer enhanced broadband

VSWR performance of 1.15:1 max thru 26GHz and 1.40:1 max

thru 40GHz.

Standard design OSMP configurations include cableconnectors,

straight and right angle, for 0.047 and 0.085 semi-rigid cable,

full detent, limited detent and smooth bore mating shrouds that

can be bulkhead or flange mounted and glass feedthroughs for

coax to circuit launchers. In-series adapters for module to mod-

ule intermating and between series adapters for integrating or

testing systems or components parameters.

1.50:1

1.40:1

1.30:1

1.20:1

1.10:1

OSMP connectors are an ideal solution for upgrading existing

systems or creating new high density designs for next generation

RF packaging. Years of design experience has made M/A-COM

an industry leader in blindmate modular interconnect technology.

Call your local M/A-COM Sales Office or authorized Distributor

for more information or samples of our new OSMP series.

0.0

8.0

16.0

24.0

32.0

40.0 GHz

Typical VSWR for OSMP Jack to Jack Adapter

Part Numbers 2980-0000-62 and 2998-5001-02

Specifications Subject to Change Without Notice.

M/A-COM, Inc.

North America: Tel. (800) 366-2266

Fax (800) 618-8883

■

Asia/Pacific: Tel. +81 3 3263 8761

Fax +81 3 3263 8769

■

Europe: Tel. +44 (1344) 869 595

Fax +44 (1344) 300 020

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