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28LV64A-T-30I/SO PDF预览

28LV64A-T-30I/SO

更新时间: 2024-11-16 04:25:43
品牌 Logo 应用领域
美国微芯 - MICROCHIP 存储内存集成电路光电二极管可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
8页 53K
描述
64K (8K x 8) Low Voltage CMOS EEPROM

28LV64A-T-30I/SO 技术参数

生命周期:Obsolete零件包装代码:SOIC
包装说明:PLASTIC, SOIC-28针数:28
Reach Compliance Code:unknown风险等级:5.84
Is Samacsys:N最长访问时间:300 ns
其他特性:MINIMUM 100K WRITE/ERASE CYCLE; 200 YEAR DATA RETENTION命令用户界面:NO
数据轮询:YESJESD-30 代码:R-PDSO-G28
长度:17.9 mm内存密度:65536 bit
内存集成电路类型:EEPROM内存宽度:8
功能数量:1端子数量:28
字数:8192 words字数代码:8000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:8KX8
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP28,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE并行/串行:PARALLEL
电源:3/3.3 V编程电压:3 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:2.65 mm最大待机电流:0.0001 A
子类别:EEPROMs最大压摆率:0.008 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL切换位:NO
宽度:7.5 mm最长写入周期时间 (tWC):3 ms
Base Number Matches:1

28LV64A-T-30I/SO 数据手册

 浏览型号28LV64A-T-30I/SO的Datasheet PDF文件第2页浏览型号28LV64A-T-30I/SO的Datasheet PDF文件第3页浏览型号28LV64A-T-30I/SO的Datasheet PDF文件第4页浏览型号28LV64A-T-30I/SO的Datasheet PDF文件第5页浏览型号28LV64A-T-30I/SO的Datasheet PDF文件第6页浏览型号28LV64A-T-30I/SO的Datasheet PDF文件第7页 
28LV64A  
64K (8K x 8) Low Voltage CMOS EEPROM  
FEATURES  
PACKAGE TYPES  
• 2.7V to 3.6V Supply  
RDY/BSY  
A12  
A7  
• 1  
2
28 Vcc  
27 WE  
26 NC  
25 A8  
• Read Access Time—300 ns  
• CMOS Technology for Low Power Dissipation  
- 8 mA Active  
- 50 µA CMOS Standby Current  
• Byte Write Time—3 ms  
• Data Retention >200 years  
• High Endurance - Minimum 100,000 Erase/Write  
Cycles  
• Automatic Write Operation  
- Internal Control Timer  
3
A6  
4
A6  
A5  
A4  
A3  
A2  
A1 10  
A0 11  
NC 12  
I/O0 13  
5
6
7
8
9
29 A8  
28 A9  
A5  
5
24 A9  
A4  
6
23 A11  
22 OE  
21 A10  
20 CE  
19 I/O7  
18 I/O6  
17 I/O5  
16 I/O4  
15 I/O3  
27 A11  
26 NC  
25 OE  
24 A10  
23 CE  
22 I/O7  
21 I/O6  
A3  
7
A2  
8
A1  
9
A0  
10  
11  
12  
13  
I/O0  
I/O1  
I/O2  
VSS 14  
-
Auto-Clear Before Write Operation  
• Pin 1 indicator on PLCC on top of package  
- On-Chip Address and Data Latches  
• Data Polling  
• Ready/Busy  
• Chip Clear Operation  
• Enhanced Data Protection  
- VCC Detector  
OE  
A11  
A9  
1
2
3
4
5
6
7
28 A10  
27 CE  
26 I/07  
25 I/06  
24 I/05  
23 I/04  
22 I/03  
A8  
NC  
WE  
Vcc  
RDY/BSY  
A12  
8
9
21 Vss  
20 I/02  
19 I/01  
18 I/00  
17 A0  
16 A1  
15 A2  
- Pulse Filter  
- Write Inhibit  
A7 10  
A6 11  
A5 12  
A4 13  
A3 14  
• Electronic Signature for Device Identification  
• Organized 8Kx8 JEDEC Standard Pinout  
- 28-pin Dual-In-Line Package  
- 32-pin Chip Carrier (Leadless or Plastic)  
- 28-pin Thin Small Outline Package (TSOP)  
8x20mm  
OE  
A11  
A9  
22  
23  
24  
25  
26  
27  
A10  
CE  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
9
I/O7  
I/O6  
I/O5  
I/O4  
I/O3  
VSS  
I/O2  
I/O1  
I/O0  
A0  
A8  
NC  
WE  
VCC  
28  
1
RDY/BSY  
-
28-pin Very Small Outline Package (VSOP)  
8x13.4mm  
2
3
4
5
6
7
A12  
A7  
A6  
A5  
A4  
A3  
• Available for Extended Temperature Ranges:  
- Commercial: 0˚C to +70˚C  
A1  
A2  
8
- Industrial: -40˚C to +85˚C  
BLOCK DIAGRAM  
DESCRIPTION  
I/O0...................I/O7  
The Microchip Technology Inc. 28LV64A is a CMOS 64K non-vol-  
atile electrically Erasable PROM organized as 8K words by 8 bits.  
The 28LV64A is accessed like a static RAM for the read or write  
cycles without the need of external components. During a “byte  
write”, the address and data are latched internally, freeing the  
microprocessor address and data bus for other operations. Fol-  
lowing the initiation of write cycle, the device will go to a busy state  
and automatically clear and write the latched data using an inter-  
nal control timer. To determine when the write cycle is complete,  
the user has a choice of monitoring the Ready/Busy output or  
using Data polling. The Ready/Busy pin is an open drain output,  
which allows easy configuration in ‘wired-or’ systems. Alterna-  
tively, Data polling allows the user to read the location last written  
to when the write operation is complete. CMOS design and pro-  
cessing enables this part to be used in systems where reduced  
power consumption and reliability are required. A complete family  
of packages is offered to provide the utmost flexibility in applica-  
tions.  
VSS  
Data Protection  
VCC  
Circuitry  
Chip Enable/  
Output Enable  
Control Logic  
CE  
OE  
Auto Erase/Write  
Timing  
Data  
Poll  
WE  
Input/Output  
Buffers  
Rdy/  
Busy  
Program Voltage  
Generation  
A0  
Y
I
I
I
I
I
I
I
I
Y Gating  
Decoder  
L
a
t
c
h
e
s
64K bit  
Cell Matrix  
X
Decoder  
I
I
I
A12  
1996 Microchip Technology Inc.  
Preliminary  
DS21113B-page 1  
This document was created with FrameMaker 4 0 4  

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