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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 27R0J | OHMITE |
获取价格 |
Power Chip® Thick Film on Alumina Substrate |
|
| 27R-1C7LF | AMPHENOL |
获取价格 |
Card Edge Connector, 27 Contact(s), 1 Row(s), Female, Right Angle, Solder Terminal, LEAD F |
|
| 27R-5C7LF | AMPHENOL |
获取价格 |
Card Edge Connector, 27 Contact(s), 1 Row(s), Female, Right Angle, Solder Terminal, LEAD F |
|
| 27RS-0 | MSYSTEM |
获取价格 |
Head-mounted Two-wire Signal Conditioners 27-UNIT |
|
| 27RS-1 | MSYSTEM |
获取价格 |
Head-mounted Two-wire Signal Conditioners 27-UNIT |
|
| 27RS-2 | MSYSTEM |
获取价格 |
Head-mounted Two-wire Signal Conditioners 27-UNIT |
|
| 27S-024S | OENINDIA |
获取价格 |
SLIDE&PIANO TYPE DIP SWITCHES |
|
| 27S-024S-XXX | OENINDIA |
获取价格 |
SLIDE & PIANO TYPE DIP SWITCHES |
|
| 27S-024X-XXX | OENINDIA |
获取价格 |
SLIDE & PIANO TYPE DIP SWITCHES |
|
| 27S-028S | OENINDIA |
获取价格 |
SLIDE&PIANO TYPE DIP SWITCHES |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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