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27C64-12/15/17/20/25 PDF预览

27C64-12/15/17/20/25

更新时间: 2022-01-19 06:10:00
品牌 Logo 应用领域
其他 - ETC 可编程只读存储器电动程控只读存储器
页数 文件大小 规格书
13页 86K
描述
EPROM

27C64-12/15/17/20/25 数据手册

 浏览型号27C64-12/15/17/20/25的Datasheet PDF文件第2页浏览型号27C64-12/15/17/20/25的Datasheet PDF文件第3页浏览型号27C64-12/15/17/20/25的Datasheet PDF文件第4页浏览型号27C64-12/15/17/20/25的Datasheet PDF文件第5页浏览型号27C64-12/15/17/20/25的Datasheet PDF文件第6页浏览型号27C64-12/15/17/20/25的Datasheet PDF文件第7页 
27C64  
64K (8K x 8) CMOS EPROM  
FEATURES  
PACKAGE TYPES  
• High speed performance  
DIP/SOIC  
- 120 ns access time available  
• CMOS Technology for low power consumption  
- 20 mA Active current  
VPP • 1  
28 VCC  
27 PGM  
26 NC  
25 A8  
24 A9  
23 A11  
22 OE  
21 A10  
20 CE  
19 O7  
18 O6  
17 O5  
16 O4  
15 O3  
A12  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
O0  
O1  
O2  
2
3
4
5
- 100 µA Standby current  
6
• Factory programming available  
• Auto-insertion-compatible plastic packages  
• Auto ID aids automated programming  
• Separate chip enable and output enable controls  
• High speed “express” programming algorithm  
• Organized 8K x 8: JEDEC standard pinouts  
- 28-pin Dual-in-line package  
7
8
9
10  
11  
12  
13  
VSS 14  
- 32-pin PLCC Package  
- 28-pin SOIC package  
PLCC  
- Tape and reel  
• Available for the following temperature ranges  
- Commercial:  
- Industrial:  
0˚C to +70˚C  
5
-40˚C to +85˚C  
29  
A6  
A5  
A8  
A9  
6
28  
7
27  
A4  
A11  
DESCRIPTION  
8
26  
A3  
A2  
NC  
OE  
9
25  
10  
The Microchip Technology Inc. 27C64 is a CMOS 64K  
bit (electrically) Programmable Read Only Memory.  
The device is organized as 8K words by 8 bits (8K  
bytes). Accessing individual bytes from an address  
transition or from power-up (chip enable pin going low)  
is accomplished in less than 120 ns. CMOS design and  
processing enables this part to be used in systems  
where reduced power consumption and high reliability  
are requirements.  
24  
A1  
A0  
NC  
O0  
A10  
CE  
O7  
O6  
11  
23  
12  
22  
13  
21  
A complete family of packages is offered to provide the  
most flexibility in applications. For surface mount appli-  
cations, PLCC or SOIC packaging is available. Tape  
and reel packaging is also available for PLCC or SOIC  
packages.  
1996 Microchip Technology Inc.  
DS11107L-page 1  
This document was created with FrameMaker 4 0 4  

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