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27C512A-12E/SO PDF预览

27C512A-12E/SO

更新时间: 2024-09-28 03:55:51
品牌 Logo 应用领域
美国微芯 - MICROCHIP 可编程只读存储器电动程控只读存储器
页数 文件大小 规格书
10页 133K
描述
512K (64K x 8) CMOS EPROM

27C512A-12E/SO 数据手册

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Obsolete Device  
27C512A  
512K (64K x 8) CMOS EPROM  
FEATURES  
PACKAGE TYPES  
• High speed performance  
PLCC  
• CMOS Technology for low power consumption  
- 25 mA Active current  
5
29  
28  
27  
26  
25  
24  
23  
22  
21  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
NC  
A8  
A9  
6
- 30 µA Standby current  
7
A11  
NC  
OE/VPP  
A10  
CE  
8
• Factory programming available  
• Auto-insertion-compatible plastic packages  
• Auto ID aids automated programming  
• High speed express programming algorithm  
• Organized 64K x 8: JEDEC standard pinouts  
- 28-pin Dual-in-line package  
9
10  
11  
12  
O7  
O6  
13  
O0  
DIP/SOIC  
- 32-pin PLCC Package  
A15  
A12  
A7  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
VCC  
A14  
A13  
A8  
- 28-pin SOIC package  
2
3
- Tape and reel  
A6  
4
A5  
• Data Retention > 200 years  
5
A9  
A4  
6
A11  
OE/VPP  
A10  
CE  
• Available for the following temperature ranges  
A3  
7
A2  
8
- Commercial:  
- Industrial:  
0°C to +70°C  
A1  
9
-40°C to +85°C  
-40°C to +125°C  
A0  
10  
11  
12  
13  
14  
O7  
O0  
O1  
O2  
VSS  
O6  
- Automotive:  
O5  
O4  
DESCRIPTION  
O3  
The Microchip Technology Inc. 27C512A is a CMOS  
512K bit electrically Programmable Read Only Memory  
(EPROM). The device is organized into 64K words by  
8 bits (64K bytes). Accessing individual bytes from an  
address transition or from power-up (chip enable pin  
going low) is accomplished in less than 90 ns. This  
very high speed device allows the most sophisticated  
microprocessors to run at full speed without the need  
for WAIT states. CMOS design and processing  
enables this part to be used in systems where reduced  
power consumption and high reliability are require-  
ments.  
A complete family of packages is offered to provide the  
most flexibility in applications. For surface mount appli-  
cations, PLCC or SOIC packaging is available. Tape or  
reel packaging is also available for PLCC or SOIC  
packages.  
2004 Microchip Technology Inc.  
DS11173G-page 1  

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