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25AA160DT-E/MS PDF预览

25AA160DT-E/MS

更新时间: 2024-11-07 06:24:03
品牌 Logo 应用领域
美国微芯 - MICROCHIP 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
30页 484K
描述
16K SPI Bus Serial EEPROM

25AA160DT-E/MS 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:TSSOP, TSSOP8,.19Reach Compliance Code:compliant
风险等级:5.52数据保留时间-最小值:200
耐久性:1000000 Write/Erase CyclesJESD-30 代码:R-PDSO-G8
JESD-609代码:e3内存密度:16384 bit
内存集成电路类型:EEPROM内存宽度:8
端子数量:8字数:2048 words
字数代码:2000最高工作温度:125 °C
最低工作温度:-40 °C组织:2KX8
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP8,.19封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH并行/串行:SERIAL
电源:2/5 V认证状态:Not Qualified
串行总线类型:SPI最大待机电流:0.000001 A
子类别:EEPROMs最大压摆率:0.005 mA
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUAL写保护:HARDWARE/SOFTWARE
Base Number Matches:1

25AA160DT-E/MS 数据手册

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25AA160C/D, 25LC160C/D  
16K SPI Bus Serial EEPROM  
Device Selection Table  
Part Number  
VCC Range  
Page Size  
Temp. Ranges  
Packages  
25LC160C  
25AA160C  
25LC160D  
25AA160D  
2.5-5.5V  
1.8-5.5V  
2.5-5.5V  
1.8-5.5V  
16 Byte  
16 Byte  
32 Byte  
32 Byte  
I,E  
I
P, SN, ST, MS, MN  
P, SN, ST, MS, MN  
P, SN, ST, MS, MN  
P, SN, ST, MS, MN  
I,E  
I
Description:  
Features:  
The Microchip Technology Inc. 25AA160C/D,  
25LC160C/D (25XX160C/D*) are 16 Kbit Serial  
Electrically Erasable PROMs. The memory is accessed  
• Max. Clock 10 MHz  
• Low-Power CMOS Technology:  
- Max. write current: 5 mA at 5.5V  
- Read current: 5 mA at 5.5V, 10 MHz  
- Standby current: 5 uA at 5.5V  
• 2048 x 8-bit Organization  
via  
a
simple Serial Peripheral Interface (SPI)  
compatible serial bus. The bus signals required are a  
clock input (SCK) plus separate data in (SI) and data  
out (SO) lines. Access to the device is controlled  
through a Chip Select (CS) input.  
• 16-Byte Page (‘C’ version devices)  
• 32-Byte Page (‘D’ version devices)  
Communication to the device can be paused via the  
hold pin (HOLD). While the device is paused, transi-  
tions on its inputs will be ignored, with the exception of  
Chip Select, allowing the host to service higher priority  
interrupts.  
• Self-Timed Erase and Write Cycles (5 ms max.)  
• Block Write Protection:  
- Protect none, 1/4, 1/2 or all of array  
• Built-In Write Protection:  
The 25XX160C/D is available in standard packages  
including 8-lead PDIP and SOIC, and advanced  
packaging including 8-lead MSOP, TSSOP, and 2x3  
TDFN. All packages are Pb-free and RoHS compliant.  
- Power-on/off data protection circuitry  
- Write enable latch  
- Write-protect pin  
• Sequential Read  
Package Types (not to scale)  
• High Reliability:  
- Endurance: > 1M erase/write cycles  
- Data retention: > 200 years  
- ESD protection: > 4000V  
Temperature Ranges Supported:  
PDIP/SOIC  
(P, SN)  
TSSOP/MSOP  
(ST, MS)  
1
2
3
4
8
7
6
5
V
CC  
CS  
SO  
WP  
CS  
SO  
WP  
VCC  
1
2
3
4
8
7
6
5
HOLD  
SCK  
SI  
HOLD  
SCK  
SI  
- Industrial (I):  
-40°C to +85°C  
V
SS  
- Automotive (E):  
-40°C to +125°C  
VSS  
• Pb-Free and RoHS Compliant  
TDFN  
(MN)  
1
2
3
4
CS  
SO  
8
7
6
5
VCC  
HOLD  
SCK  
SI  
WP  
VSS  
*25XX160C/D is used in this document as a generic part  
number for the 25AA160C/D, 25LC160C/D devices.  
© 2009 Microchip Technology Inc.  
DS22150A-page 1  

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