是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | SOP, | 针数: | 8 |
Reach Compliance Code: | compliant | Factory Lead Time: | 15 weeks |
风险等级: | 1.13 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 158540 |
Samacsys Pin Count: | 8 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Small Outline Packages | Samacsys Footprint Name: | 8-Lead(SN) SOIC |
Samacsys Released Date: | 2015-04-16 09:48:08 | Is Samacsys: | N |
其他特性: | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 最大时钟频率 (fCLK): | 0.4 MHz |
数据保留时间-最小值: | 200 | JESD-30 代码: | R-PDSO-G8 |
JESD-609代码: | e3 | 长度: | 4.9 mm |
内存密度: | 32768 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 8 | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 4096 words | 字数代码: | 4000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 4KX8 |
输出特性: | OPEN-DRAIN | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 1.75 mm | 串行总线类型: | I2C |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 3.9 mm |
最长写入周期时间 (tWC): | 5 ms | Base Number Matches: | 1 |
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