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24LC08BH-I/MS PDF预览

24LC08BH-I/MS

更新时间: 2024-11-20 06:25:23
品牌 Logo 应用领域
美国微芯 - MICROCHIP 存储内存集成电路光电二极管可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟
页数 文件大小 规格书
28页 756K
描述
8K I2C™ Serial EEPROM with Half-Array Write-Protect

24LC08BH-I/MS 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:MSOP
包装说明:ROHS COMPLIANT, PLASTIC, MSOP-8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.15
最大时钟频率 (fCLK):0.4 MHz数据保留时间-最小值:200
耐久性:1000000 Write/Erase CyclesI2C控制字节:1010XMMR
JESD-30 代码:S-PDSO-G8JESD-609代码:e3
长度:3 mm内存密度:2048 bit
内存集成电路类型:EEPROM内存宽度:8
湿度敏感等级:1功能数量:1
端子数量:8字数:256 words
字数代码:256工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256X8封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP8,.19
封装形状:SQUARE封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行:SERIAL峰值回流温度(摄氏度):260
电源:3/5 V认证状态:Not Qualified
座面最大高度:1.1 mm串行总线类型:I2C
最大待机电流:0.000001 A子类别:EEPROMs
最大压摆率:0.003 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
宽度:3 mm最长写入周期时间 (tWC):5 ms
写保护:HARDWAREBase Number Matches:1

24LC08BH-I/MS 数据手册

 浏览型号24LC08BH-I/MS的Datasheet PDF文件第2页浏览型号24LC08BH-I/MS的Datasheet PDF文件第3页浏览型号24LC08BH-I/MS的Datasheet PDF文件第4页浏览型号24LC08BH-I/MS的Datasheet PDF文件第5页浏览型号24LC08BH-I/MS的Datasheet PDF文件第6页浏览型号24LC08BH-I/MS的Datasheet PDF文件第7页 
24AA08H/24LC08BH  
8K I2CSerial EEPROM with Half-Array Write-Protect  
Device Selection Table  
Description:  
Part  
Number  
VCC  
Range  
Max. Clock  
Frequency  
Temp.  
Ranges  
The Microchip Technology Inc. 24AA08H/24LC08BH  
(24XX08H*) is an 8 Kbit Electrically Erasable PROM.  
The device is organized as four blocks of 256 x 8-bit  
memory with a 2-wire serial interface. Low-voltage  
design permits operation down to 1.7V, with standby  
and active currents of only 1 μA and 1 mA,  
24AA08H  
1.7-5.5  
2.5-5.5  
400 kHz(1)  
400 kHz  
I
24LC08BH  
I, E  
Note 1: 100 kHz for VCC <2.5V  
respectively. The 24XX08H also has a page write  
capability for up to 16 bytes of data. The 24XX08H is  
available in the standard 8-pin PDIP, surface mount  
SOIC, TSSOP, 2x3 TDFN and MSOP packages, and  
is also available in the 5-lead SOT-23 package. All  
packages are Pb-free and RoHS compliant.  
Features:  
• Single Supply with Operation Down to 1.7V for  
24AA08H Devices, 2.5V for 24LC08BH Devices  
• Low-Power CMOS Technology:  
- Read current 1 mA, max.  
Block Diagram  
- Standby current 1 μA, max.  
• 2-Wire Serial Interface, I2C™ Compatible  
• Schmitt Trigger Inputs for Noise Suppression  
• Output Slope Control to eliminate Ground Bounce  
• 100 kHz and 400 kHz Clock Compatibility  
• Page Write Time 3 ms, typical  
HV  
Generator  
WP  
I/O  
Control  
Logic  
Memory  
Control  
Logic  
EEPROM  
Array  
XDEC  
• Self-Timed Erase/Write Cycle  
Page  
Latches  
• 16-Byte Page Write Buffer  
• Hardware Write-Protect for Half-Array (200h-3FFh)  
• ESD Protection >4,000V  
I/O  
SCL  
YDEC  
• More than 1 Million Erase/Write Cycles  
• Data Retention >200 years  
SDA  
Sense Amp.  
R/W Control  
VCC  
VSS  
• Factory Programming available  
• Packages include 8-lead PDIP, SOIC, TSSOP,  
TDFN, MSOP and 5-lead SOT-23  
Package Types  
• Pb-Free and RoHS Compliant  
Temperature Ranges:  
SOIC, TSSOP  
PDIP, MSOP  
- Industrial (I):  
-40°C to +85°C  
A0  
1
8
VCC  
1
8
7
A0  
A1  
A2  
VCC  
WP  
- Automotive (E): -40°C to +125°C  
2
3
4
A1  
A2  
2
3
7
6
WP  
SCL  
6
5
SCL  
SDA  
VSS  
4
5
SDA VSS  
SOT-23-5  
TDFN  
A0  
1
VCC  
WP  
8
7
6
5
WP  
Vcc  
1
5
4
SCL  
2
3
4
A1  
SCL  
SDA  
2
3
Vss  
A2  
VSS  
SDA  
Note:  
Pins A0, A1 and A2 are not used by the 24XX08. (No  
internal connections).  
*24XX08H is used in this document as a generic part  
number for the 24AA08H/24LC08BH devices.  
© 2008 Microchip Technology Inc.  
DS22084A-page 1  

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