是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.18 |
Is Samacsys: | N | 最大时钟频率 (fCLK): | 0.4 MHz |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e3 |
长度: | 4.9 mm | 内存密度: | 2048 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 256 words |
字数代码: | 256 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 256X8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 1.75 mm | 串行总线类型: | I2C |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 3.91 mm |
最长写入周期时间 (tWC): | 1 ms | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
24C02C/SNVA0G | MICROCHIP |
获取价格 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 | |
24C02C/ST | ETC |
获取价格 |
SERIAL EEPROM|256X8|CMOS|TSSOP|8PIN|PLASTIC | |
24C02C_07 | MICROCHIP |
获取价格 |
2K 5.0V I2C⑩ Serial EEPROM | |
24C02C_08 | MICROCHIP |
获取价格 |
2K 5.0V I2C™ Serial EEPROM | |
24C02C-C/MCG | MICROCHIP |
获取价格 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO- | |
24C02C-C/P | MICROCHIP |
获取价格 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8 | |
24C02C-C/SNG | MICROCHIP |
获取价格 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 | |
24C02C-C/STG | MICROCHIP |
获取价格 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-8 | |
24C02CE/MC | MICROCHIP |
获取价格 |
2K 5.0V I2C⑩ Serial EEPROM | |
24C02C-E/MC | MICROCHIP |
获取价格 |
2K 5.0V I2C™ Serial EEPROM |