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24AA64-I/SMG PDF预览

24AA64-I/SMG

更新时间: 2024-11-13 13:03:59
品牌 Logo 应用领域
美国微芯 - MICROCHIP 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
28页 418K
描述
8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8

24AA64-I/SMG 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.27
最大时钟频率 (fCLK):0.4 MHz数据保留时间-最小值:200
耐久性:1000000 Write/Erase CyclesI2C控制字节:1010DDDR
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
长度:5.245 mm内存密度:65536 bit
内存集成电路类型:EEPROM内存宽度:8
湿度敏感等级:1功能数量:1
端子数量:8字数:8192 words
字数代码:8000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:8KX8封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP8,.3
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
并行/串行:SERIAL峰值回流温度(摄氏度):260
电源:2/5 V认证状态:Not Qualified
座面最大高度:2.03 mm串行总线类型:I2C
最大待机电流:0.000001 A子类别:EEPROMs
最大压摆率:0.003 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
宽度:5.23 mm最长写入周期时间 (tWC):5 ms
写保护:HARDWAREBase Number Matches:1

24AA64-I/SMG 数据手册

 浏览型号24AA64-I/SMG的Datasheet PDF文件第2页浏览型号24AA64-I/SMG的Datasheet PDF文件第3页浏览型号24AA64-I/SMG的Datasheet PDF文件第4页浏览型号24AA64-I/SMG的Datasheet PDF文件第5页浏览型号24AA64-I/SMG的Datasheet PDF文件第6页浏览型号24AA64-I/SMG的Datasheet PDF文件第7页 
24AA64/24LC64/24FC64  
64K I2CSerial EEPROM  
Description:  
Device Selection Table  
Part  
Number  
VCC  
Range  
Max. Clock  
Frequency  
Temp.  
Ranges  
The Microchip Technology Inc. 24AA64/24LC64/  
24FC64 (24XX64*) is a 64 Kbit Electrically Erasable  
PROM. The device is organized as a single block of 8K  
x 8-bit memory with a 2-wire serial interface. Low-volt-  
age design permits operation down to 1.7V, with  
standby and active currents of only 1 μA and 1 mA,  
respectively. It has been developed for advanced, low-  
power applications such as personal communications  
or data acquisition. The 24XX64 also has a page write  
capability for up to 32 bytes of data. Functional address  
lines allow up to eight devices on the same bus, for up  
to 512 Kbits address space. The 24XX64 is available in  
the standard 8-pin PDIP, surface mount SOIC, TSSOP,  
DFN and MSOP packages.  
24AA64  
24LC64  
24FC64  
1.7-5.5  
2.5-5.5  
1.7-5.5  
400 kHz(1)  
400 kHz  
1 MHz(2)  
I
I, E  
I
Note 1: 100 kHz for VCC <2.5V  
2: 400 kHz for VCC <2.5V  
Features:  
• Single-supply with operation down to 1.7V for  
24AA64/24FC64 devices, 2.5V for 24LC64  
devices  
• Low-power CMOS technology:  
- Active current 1 mA, typical  
Package Types  
SOIC, TSSOP  
PDIP, MSOP  
- Standby current 1 μA, typical  
A0  
1
8
VCC  
• 2-wire serial interface, I2C™ compatible  
• Schmitt Trigger inputs for noise suppression  
• Output slope control to eliminate ground bounce  
• 100 kHz and 400 kHz clock compatibility  
• 1 MHz clock for FC versions  
1
2
3
4
8
7
6
5
A0  
A1  
VCC  
WP  
A1  
A2  
2
3
7
6
WP  
SCL  
A2  
SCL  
SDA  
VSS  
4
5
SDA  
VSS  
• Page write time 5 ms, typical  
DFN  
• Self-timed erase/write cycle  
1
VCC  
WP  
A0  
A1  
A2  
8
7
6
5
• 32-byte page write buffer  
2
3
4
• Hardware write-protect  
SCL  
SDA  
VSS  
• ESD protection > 4,000V  
• More than 1 million erase/write cycles  
• Data retention > 200 years  
Block Diagram  
• Factory programming available  
• Packages include 8-lead PDIP, SOIC, TSSOP,  
MSOP and DFN  
HV  
Generator  
WP  
• Pb-free and RoHS compliant  
Temperature ranges:  
I/O  
Control  
Logic  
Memory  
Control  
Logic  
EEPROM  
Array  
- Industrial (I): -40°C to +85°C  
- Automotive (E): -40°C to +125°C  
XDEC  
Page  
Latches  
I/O  
SCL  
YDEC  
SDA  
VCC  
VSS  
Sense Amp.  
R/W Control  
* 24XX64 is used in this document as a generic part  
number for the 24AA64/24LC64/24FC64 devices.  
© 2007 Microchip Technology Inc.  
DS21189L-page 1  

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