是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | DFN | 包装说明: | VSON, SOLCC8,.11,20 |
针数: | 8 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
Factory Lead Time: | 9 weeks | 风险等级: | 1.65 |
Samacsys Confidence: | 3 | Samacsys Status: | Released |
Samacsys PartID: | 458073 | Samacsys Pin Count: | 9 |
Samacsys Part Category: | Undefined or Miscellaneous | Samacsys Package Category: | Small Outline No-lead |
Samacsys Footprint Name: | tdfn | Samacsys Released Date: | 2020-02-04 09:37:57 |
Is Samacsys: | N | 最大时钟频率 (fCLK): | 0.4 MHz |
数据保留时间-最小值: | 200 | 耐久性: | 1000000 Write/Erase Cycles |
I2C控制字节: | 1010DDDR | JESD-30 代码: | R-PDSO-N8 |
JESD-609代码: | e4 | 长度: | 3 mm |
内存密度: | 131072 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 8 | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 16384 words | 字数代码: | 16000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 16KX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VSON |
封装等效代码: | SOLCC8,.11,20 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, VERY THIN PROFILE | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | 260 | 电源: | 2/5 V |
认证状态: | Not Qualified | 座面最大高度: | 0.8 mm |
串行总线类型: | I2C | 最大待机电流: | 0.000001 A |
子类别: | EEPROMs | 最大压摆率: | 0.003 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 2 mm |
最长写入周期时间 (tWC): | 5 ms | 写保护: | HARDWARE |
Base Number Matches: | 1 |
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