是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | MSOP | 包装说明: | TSSOP, TSSOP8,.19 |
针数: | 8 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
Factory Lead Time: | 5 weeks | 风险等级: | 5.46 |
Is Samacsys: | N | 最大时钟频率 (fCLK): | 0.4 MHz |
数据轮询: | YES | 数据保留时间-最小值: | 200 |
耐久性: | 1000000 Write/Erase Cycles | I2C控制字节: | 1010XXMR |
JESD-30 代码: | S-PDSO-G8 | JESD-609代码: | e3 |
长度: | 3 mm | 内存密度: | 4096 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 256 words |
字数代码: | 256 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 256X8 | 输出特性: | OPEN-DRAIN |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP8,.19 | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 页面大小: | 16 words |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | 260 |
电源: | 2/5 V | 认证状态: | Not Qualified |
反向引出线: | NO | 筛选级别: | ISO/TS-16949 |
座面最大高度: | 1.1 mm | 串行总线类型: | I2C |
最大待机电流: | 0.000001 A | 子类别: | EEPROMs |
最大压摆率: | 0.003 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 1.7 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) - annealed | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 3 mm |
最长写入周期时间 (tWC): | 5 ms | 写保护: | HARDWARE |
Base Number Matches: | 1 |
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完全替代 |
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