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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 224-5248-00-0602J | 3M |
获取价格 |
DIP24, IC SOCKET |
|
| 224-5248-19-0602J | 3M |
获取价格 |
DIP24, IC SOCKET |
|
| 22-45-5023 | MOLEX |
获取价格 |
Board Connector, 2 Contact(s), 1 Row(s), Female, Straight, IDC Terminal, ROHS COMPLIANT |
|
| 22-45-5053 | MOLEX |
获取价格 |
Board Connector, 5 Contact(s), 1 Row(s), Female, Straight, 0.1 inch Pitch, IDC Terminal, L |
|
| 22-45-5073 | MOLEX |
获取价格 |
Board Connector, 7 Contact(s), 1 Row(s), Female, Straight, IDC Terminal, ROHS COMPLIANT |
|
| 22-45-5083 | MOLEX |
获取价格 |
Board Connector, 8 Contact(s), 1 Row(s), Female, Straight, IDC Terminal, ROHS COMPLIANT |
|
| 22-45-5093 | MOLEX |
获取价格 |
Board Connector, 9 Contact(s), 1 Row(s), Female, Straight, IDC Terminal, ROHS COMPLIANT |
|
| 22-45-5103 | MOLEX |
获取价格 |
Board Connector, 10 Contact(s), 1 Row(s), Female, Straight, IDC Terminal, ROHS COMPLIANT |
|
| 22-45-5113 | MOLEX |
获取价格 |
Board Connector, 11 Contact(s), 1 Row(s), Female, Straight, IDC Terminal, ROHS COMPLIANT |
|
| 22-45-5153 | MOLEX |
获取价格 |
Board Connector, 15 Contact(s), 1 Row(s), Female, Straight, IDC Terminal, ROHS COMPLIANT |
|
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
意法半导体发布第四代SiC技术，助力电动汽车电驱
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