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2039-80SMLF PDF预览

2039-80SMLF

更新时间: 2024-01-06 02:23:28
品牌 Logo 应用领域
伯恩斯 - BOURNS 电信电信集成电路
页数 文件大小 规格书
2页 267K
描述
TELECOM, SURGE PROTECTION CIRCUIT, XSS, ROHS COMPLIANT PACKAGE

2039-80SMLF 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:unknown风险等级:5.65
Is Samacsys:NJESD-30 代码:X-XXSS-X
功能数量:1最高工作温度:85 °C
最低工作温度:-55 °C封装主体材料:UNSPECIFIED
封装形状:UNSPECIFIED封装形式:SPECIAL SHAPE
认证状态:Not Qualified表面贴装:NO
电信集成电路类型:SURGE PROTECTION CIRCUIT温度等级:OTHER
端子形式:UNSPECIFIED端子位置:UNSPECIFIED
Base Number Matches:1

2039-80SMLF 数据手册

 浏览型号2039-80SMLF的Datasheet PDF文件第2页 
Features  
RoHS compliant* version available  
Leadless, surface mount for economical  
assembly  
Low capacitance and insertion loss  
High surge current rating  
Fast response to transients  
Compact “mini” size  
2039-xxx-SM Precision, Fast Responding, High Voltage Gas Discharge Tube  
Bourns now offers miniature Surface Mount (SM) 2-electrode GDT surge protectors with sparkover voltage up to 1100 V. Compatible with  
“pick and place” assembly systems and only 5 mm in diameter, the 2039 Series is ideal for board level protection of high bandwidth  
applications such as xDSL, cable broadband and high speed Ethernet. The 2039 Series features high energy-handling capability, long and  
stable life performance and low capacitance of less than 1 pF.  
Bourns® GDTs are designed to prevent damage from transient disturbances by acting as a “crowbar” to create a short-to-ground circuit  
during conduction. When an electrical surge exceeds the defined breakdown voltage level of the GDT, the device becomes ionized and  
conduction takes place within a fraction of a microsecond. When the surge passes and system voltage returns to normal levels, the GDT  
returns to its high-impedance (off) state.  
Characteristics  
Test Methods per ITU-T (CCITT) K.12 and IEEE C62.31  
Model No.  
Characteristic  
2039-80-SM  
800 V  
2039-110-SM  
1100 V  
DC Sparkover 20 % ꢀ 100 V/s  
Impulse Sparkover ꢀ 1000V/μs  
1250 V  
1500 V  
9
Insulation Resistance (IR)................................ 100 V.................................................................> 10 Ω  
Arc Voltage ...................................................... 1 A.....................................................................~ 10 V  
Glow-Arc Transition Current.......................................................................................................< 0.5 A  
Capacitance .................................................... 1 MHz ...............................................................< 1 pF  
1
DC Holdover Voltage .................................... 135 V.................................................................< 150 ms  
2
Max. Single Discharge .................................. 5 kA...................................................................> 1 operation  
2
Impulse Discharge Current.............................. 2.5 kA, 8/20 µs ...............................................> 10 operations  
100 A, 10/1000 µs.............................................> 100 operations  
10 A, 10/1000 µs ..............................................> 1500 operations  
Alternating Discharge Current......................... 2.5 Arms, 1 s.....................................................> 10 operations  
Operating and Storage Temperature.......................................................................................... -55 to +85 °C  
Climatic Category (IEC 60068-1)................................................................................................ 40/90/21  
Notes:  
• Surface Mount (SM) parts may show a temporary increase in DCBD after the solder reflow process. Most devices will recover  
within 24 hours time. It should be noted that there is no quality defect nor change in protection levels during the temporary change  
in DCBD.  
8
• Sparkover limits after life +30/-25 %, IR >10 Ω.  
• At delivery AQL 0.65 Level II, DIN ISO 2859.  
1
2
Network applied.  
DC Sparkover may exceed +30/-25 % but will continue to protect without venting.  
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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