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1SS355_11 PDF预览

1SS355_11

更新时间: 2024-10-30 07:23:47
品牌 Logo 应用领域
TAK_CHEONG 二极管开关
页数 文件大小 规格书
5页 187K
描述
200mW SOD-323 SURFACE MOUNT Small Outline Flat Lead Plastic Package High Speed Switching Diode

1SS355_11 数据手册

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TAK CHEONG ®  
SEMICONDUCTOR  
200mW SOD-323 SURFACE MOUNT  
Small Outline Flat Lead Plastic Package  
High Speed Switching Diode  
Absolute Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Value  
Units  
PD  
TSTG  
TJ  
Power Dissipation  
200  
-65 to +150  
+150  
80  
mW  
°C  
Storage Temperature Range  
Operating Junction Temperature  
Reverse Voltage  
°C  
VR  
V
VRM  
IFM  
Repetitive Peak Reverse Voltage  
Forward Current  
90  
V
250  
mA  
mA  
mA  
IO  
Continuous Forward Current  
Repetitive Peak Forward Current  
150  
IFRM  
500  
Peak Forward Surge Current  
(Pulse Width=1us)  
IFSM  
2
A
These ratings are limiting values above which the serviceability of the diode may be impaired.  
Specification Features:  
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
High Speed Switching Device (TRR <4.0 nS)  
General Purpose Diodes  
DEVICE MARKING CODE:  
Device  
Flat Lead SOD-323 Small Outline Plastic Package  
Surface Device Type Mounting  
RoHS Compliant  
Device Type  
1SS355  
Marking  
S4  
Green EMC  
Matte Tin(Sn) Lead Finish  
Band Indicates Cathode  
Electrical Characteristics  
TA = 25°C unless otherwise noted  
Limits  
Symbol  
Parameter  
Test Condition  
IR=100µA  
Unit  
Min  
Max  
BV  
IR  
Breakdown Voltage  
80  
Volts  
nA  
Reverse Leakage Current  
Forward Voltage  
VR=80V  
100  
1.2  
VF  
TRR  
IF=100mA  
IF=10mA  
Volts  
Reverse Recovery Time  
VR=6V  
4
4
nS  
pF  
RL=100Ω  
VR=0.5V, f=1MHZ  
C
Capacitance  
Number: DB-010  
July 2011 Release, Revision F  
Page 1  

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