1N5802-1N5806
HIGH EFFICIENCY RECTIFIERS
High-reliability discrete products
and engineering services since 1977
FEATURES
Available as “HR” (high reliability) screened per MIL-PRF-19500, JANTX level. Add “HR” suffix to base part number.
Available as non-RoHS (Sn/Pb plating), standard, and as RoHS by adding “-PBF” suffix.
MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
Working peak reverse voltage
1N5802
1N5803
1N5804
1N5805
1N5806
50
75
VRWM
V
100
125
150
Forward surge current (1)
IFSM
IO1
35
A
A
Average rectified output current @ TL = 75°C at 3/8” lead length (2)
Average rectified output current @ TA = 55°C at 3/8” lead length (3)
Capacitance @ VR = 10V, f = 1MHz, Vsig = 50mV(p-p)
Reverse recovery time (4)
2.5
IO2
1.0
A
C
25
25
pF
ns
trr
Solder temperature @ 10 s
TSP
260
°C
Junction and storage temperature range
Thermal resistance junction to lead (L = 0.375”)
TJ, Tstg
RѲJL
-65 to +175
36
°C
°C/W
Note 1: TA = 25°C @ IO = 1.0A and VRWM for 10 8.3ms surges at 1 minute intervals.
Note 2: IO1 is rated at 2.5A @ TL = 75°C at 3/8” lead length. Derate at 25mA/°C for TL above 75°C.
Note 3: IO2 is rated at 1.0A @ TA = 55°C for PC boards where thermal resistance from mounting point t ambient is sufficiently controlled (RѲJX < 154°C/W) where TJ(max) 175°C is not exceeded.
Derate at 8.33mA/°C for TA above 55°C.
Note 4: IF = 0.5A, IRM = 0.5A, IR(REC) = 0.05A.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)
Minimum
Thermal
impedance @
breakdown
voltage @
100µA
Maximum reverse
current @ VRWM
Maximum surge
current (5)
Maximum reverse
recovery time (6)
Maximum forward voltage
(7)
tH = 10ms
Part
number
V(BR)
VFM
IR
IFSM
trr
ZѲJX
Volts
µA
Volts
Amps
ns
°C/W
IF = 1.0A
0.875
0.875
0.875
0.875
0.875
IF = 2.5A
0.975
0.975
0.975
0.975
0.975
25°C
125°C
175
175
175
175
175
1N5802
1N5803
1N5804
1N5805
1N5806
60
85
1
1
1
1
1
35
35
35
35
35
25
25
25
25
25
4.0
4.0
4.0
4.0
4.0
110
135
160
Note 5: TA = 2.5°C @ IO = 1.0A and VRWM for ten 8.3ms surges at 1 minute intervals.
Note 6: IF = 0.5A, IRM = 0.5A, IR(REC) = 0.05A.
Note 7: See figure 1 for thermal impedance curve.
Rev. 20150709