1N4942 thru 1N4948
VOIDLESS-HERMETICALLY SEALED
FAST RECOVERY GLASS RECTIFIERS
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
This “fast recovery” rectifier diode series is military qualified to MIL-PRF-19500/359
and is ideal for high-reliability applications where a failure cannot be tolerated.
These industry-recognized 1.0 Amp rated rectifiers for working peak reverse
voltages from 200 to 1000 volts are hermetically sealed with voidless-glass
construction using an internal “Category I” metallurgical bond. These devices are
similar in ratings to the 1N5615 thru 1N5623 series where surface mount MELF
package configurations are also available by adding a “US” suffix (see separate
data sheet for 1N5615US thru 1N5623US). Microsemi also offers numerous other
rectifier products to meet higher and lower current ratings with various recovery time
speed requirements including fast and ultrafast device types in both through-hole
and surface mount packages.
“A” Package
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
• Popular JEDEC registered 1N4942 to 1N4948 series
• Voidless hermetically sealed glass package
• Triple-Layer Passivation
• Internal “Category I” Metallurgical bonds
• Working Peak Reverse Voltage 200 to 1000 Volts.
•
Fast recovery 1 Amp rectifiers 200 to 1000 V
•
•
Military and other high-reliability applications
General rectifier applications including bridges, half-
bridges, catch diodes, etc.
•
•
•
High forward surge current capability
Extremely robust construction
• JAN, JANTX, and JANTXV available per MIL-PRF-
Low thermal resistance
19500/359 (for JANS, see 1N5615 thru 1N5623)
•
Controlled avalanche with peak reverse power
• Surface mount equivalents also available in a square
end-cap MELF configuration with “US” suffix (see
separate data sheet for 1N5615US thru 1N5623US)
capability
•
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
• Junction & Storage Temperature: -65oC to +175oC
•
•
CASE: Hermetically sealed voidless hard glass with
• Thermal Resistance: 38oC/W junction to lead at 3/8
Tungsten slugs
inch (10 mm) lead length from body
TERMINATIONS: Axial leads are copper with
Tin/Lead (Sn/Pb) finish
• Thermal Impedance: 4.5oC/W @ 10 ms heating time
•
•
•
•
•
MARKING: Body paint and part number, etc.
POLARITY: Cathode band
TAPE & REEL option: Standard per EIA-296
WEIGHT: 340 mg
• Average Rectified Forward Current (IO): 1.0 Amps @
TA = 55ºC and 0.750 Amps at TA = 100ºC
• Forward Surge Current: 15 Amps @ 8.3 ms half-sine
• Solder Temperatures: 260ºC for 10 s (maximum)
See package dimensions on last page
ELECTRICAL CHARACTERISTICS
WORKING
AVERAGE
RECTIFIED
CURRENT
MAXIMUM
FORWARD
VOLTAGE
MAXIMUM
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
SURGE
MAXIMUM
REVERSE
Maximum
PEAK
REVERSE
CURRENT
CAPACITANCE
REVERSE
VOLTAGE
VRWM
TYPE
CURRENT RECOVERY
(NOTE 1)
IFSM
AMPS
(NOTE 2)
trr
ns
C @ -12V
pF
BV @ 50µA
IO
VF @ 1 A
VOLTS
IR @ VRWM
VOLTS
VOLTS
AMPS
µA
55oC
100oC
25oC
150oC
JAN1N4942
JAN1N4944
JAN1N4946
JAN1N4947
JAN1N4948
200
400
220
440
660
880
1.00
1.00
1.00
1.00
1.00
.750
.750
.750
.750
.750
1.3
1.3
1.3
1.3
1.3
1.0
1.0
1.0
1.0
200
200
200
200
45
35
25
20
15
15
15
15
15
15
150
150
250
250
500
600
800
1000
NOTE 1: TA = 100oC, 8.3 m1s1s00urges
NOTE 2: IF = 0.5A, I 1.0= 1A,2I0R0(REC) = .250A
RM
Copyright 2004
Microsemi
Page 1
12-08-2004 REV A
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503