1N4448HLP
SURFACE MOUNT FAST SWITCHING DIODE
Features
Mechanical Data
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Fast Switching Speed
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Case: DFN1006-2
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminal Connections: Cathode Dot
Terminals: Finish - NiPdAu over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.001 grams (approximate)
Ultra-Small Surface Mount Package
For General Purpose Switching Applications
High Conductance
Lead Free by Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
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Qualified to AEC-Q101 Standards for High Reliability
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DFN1006-2
BOTTOM VIEW
Maximum Ratings @T = 25°C unless otherwise specified
A
Characteristic
Non-Repetitive Peak Reverse Voltage
Symbol
VRM
Value
100
Unit
V
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
80
V
RMS Reverse Voltage
Forward Continuous Current
Average Rectified Output Current
57
250
125
V
mA
mA
VR(RMS)
IFM
IO
2.0
1.0
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0s
A
IFSM
Thermal Characteristics
Characteristic
Power Dissipation (Note 4)
Symbol
Value
250
Unit
mW
PD
Thermal Resistance Junction to Ambient (Note 4)
Operating and Storage Temperature Range
500
°C/W
°C
Rθ
JA
-65 to +150
TJ , TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Symbol
Min
Max
Unit
Test Conditions
Reverse Breakdown Voltage (Note 3)
80
V
V(BR)R
⎯
IR = 100μA
IF = 5.0mA
IF = 10mA
IF = 100mA
IF = 150mA
0.62
⎯
⎯
0.72
0.855
1.0
Forward Voltage
V
VF
1.25
⎯
VR = 80V
nA
μA
μA
nA
100
50
30
VR = 75V, TJ = 150°C
VR = 25V, TJ = 150°C
VR = 20V
Peak Reverse Current (Note 3)
IR
⎯
25
Total Capacitance
3.0
4.0
pF
CT
trr
⎯
⎯
VR = 0.5V, f = 1.0MHz
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Reverse Recovery Time
ns
Notes:
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Short duration pulse test used to minimize self-heating effect.
4. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
1 of 3
www.diodes.com
March 2008
© Diodes Incorporated
1N4448HLP
Document number: DS30590 Rev. 8 - 2