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1N4001FF PDF预览

1N4001FF

更新时间: 2024-11-18 22:37:55
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 34K
描述
Axial Lead Standard Recovery Rectifiers

1N4001FF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:DO-41包装说明:O-PALF-W2
针数:2Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.10.00.80
风险等级:5.02外壳连接:ISOLATED
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODE最大正向电压 (VF):1.1 V
JEDEC-95代码:DO-41JESD-30 代码:O-PALF-W2
JESD-609代码:e3最大非重复峰值正向电流:30 A
元件数量:1端子数量:2
最高工作温度:175 °C最大输出电流:1 A
封装主体材料:PLASTIC/EPOXY封装形状:ROUND
封装形式:LONG FORM峰值回流温度(摄氏度):260
认证状态:Not Qualified最大重复峰值反向电压:50 V
子类别:Rectifier Diodes表面贴装:NO
端子面层:Tin (Sn)端子形式:WIRE
端子位置:AXIAL处于峰值回流温度下的最长时间:40
Base Number Matches:1

1N4001FF 数据手册

 浏览型号1N4001FF的Datasheet PDF文件第2页浏览型号1N4001FF的Datasheet PDF文件第3页浏览型号1N4001FF的Datasheet PDF文件第4页 
1N4001, 1N4002, 1N4003,  
1N4004, 1N4005, 1N4006,  
1N4007  
1N4004 and 1N4007 are Preferred Devices  
Axial Lead Standard  
Recovery Rectifiers  
http://onsemi.com  
This data sheet provides information on subminiature size, axial  
lead mounted rectifiers for general−purpose low−power applications.  
LEAD MOUNTED RECTIFIERS  
50−1000 VOLTS  
Features  
Shipped in plastic bags, 1000 per bag  
Available Tape and Reeled, 5000 per reel, by adding a “RL” suffix to  
the part number  
DIFFUSED JUNCTION  
Available in Fan−Fold Packaging, 3000 per box, by adding a “FF”  
suffix to the part number  
These devices are manufactured with a Pb−Free external lead  
finish only*  
Mechanical Characteristics  
Case: Epoxy, Molded  
Weight: 0.4 gram (approximately)  
Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
CASE 59−10  
AXIAL LEAD  
PLASTIC  
Lead and Mounting Surface Temperature for Soldering Purposes:  
220°C Max. for 10 Seconds, 1/16 in. from case  
Polarity: Cathode Indicated by Polarity Band  
MARKING DIAGRAM  
AL  
1N  
400x  
YYWW  
AL  
= Assembly Location  
1N400x = Device Number  
x
YY  
WW  
= 1, 2, 3, 4, 5, 6 or 7  
= Year  
= Work Week  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 3 of  
this data sheet.  
Preferred devices are recommended choices for future use  
and best overall value.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
December, 2004 − Rev. 9  
1N4001/D  

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