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1N3034AUR-1E3TR PDF预览

1N3034AUR-1E3TR

更新时间： 2024-11-23 13:44:11
品牌 Logo 应用领域
美高森美 - MICROSEMI 测试二极管
页数 文件大小 规格书
3页 168K
描述
Zener Diode, 39V V(Z), 10%, 1.25W, Silicon, Unidirectional, DO-213AB, ROHS COMPLIANT, HERMETIC SEALED, LEADLESS, GLASS, MELF-2

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1N3034AUR-1E3TR 技术参数

是否Rohs认证：符合生命周期：Obsolete
零件包装代码：DO-213AB包装说明：O-LELF-R2
针数：2Reach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8541.10.00.50
风险等级：5.65Is Samacsys：N
其他特性：METALLURGICALLY BONDED, HIGH RELIABILITY外壳连接：ISOLATED
配置：SINGLE二极管元件材料：SILICON
二极管类型：ZENER DIODEJEDEC-95代码：DO-213AB
JESD-30 代码：O-LELF-R2JESD-609代码：e3
元件数量：1端子数量：2
封装主体材料：GLASS封装形状：ROUND
封装形式：LONG FORM峰值回流温度（摄氏度）：NOT SPECIFIED
极性：UNIDIRECTIONAL最大功率耗散：1.25 W
认证状态：Not Qualified标称参考电压：39 V
表面贴装：YES技术：ZENER
端子面层：MATTE TIN端子形式：WRAP AROUND
端子位置：END处于峰值回流温度下的最长时间：NOT SPECIFIED
最大电压容差：10%工作测试电流：6.5 mA
Base Number Matches：1

1N3034AUR-1E3TR 数据手册

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1N3016BUR-1 thru 1N3051BUR-1, e3  
(or MLL3016B thru MLL3051B, e3)  
Surface Mount 1.5 W  
S C O T T S D A L E D I V I S I O N  
GLASS ZENER DIODES  
DESCRIPTION  
APPEARANCE  
This surface mountable zener diode series is similar to the 1N3016 thru  
1N3051 JEDEC registration in the DO-13 package except that it meets the  
surface mount DO-213AB outline. It is an ideal selection for applications of  
high density and low parasitic requirements. Due to its glass hermetic seal  
qualities and metallurgically enhanced internal construction, it is also well  
suited for high-reliability applications. This can be acquired by a source  
control drawing (SCD), or by ordering device types with MQ, MX, or MV  
prefix to part number for equivalent screening to JAN, JANTX or JANTXV.  
DO-213AB  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
•
Leadless surface mount package equivalents to the  
JEDEC registered 1N3016 thru 1N3051 except with  
higher power rating of 1.5 Watts  
•
Regulates voltage over a broad operating current  
and temperature range  
•
•
•
•
•
•
Wide selection from 6.8 to 200 V  
Tight voltage tolerances available  
Low reverse (leakage) currents  
Leadless package for surface mounting  
Ideal for high-density mounting  
•
•
•
•
•
Ideal for high-density mounting  
Voltage range: 6.8 to 200 volts  
Hermetically sealed, double-slug glass construction  
Metallurgically enhanced contact construction.  
Options for screening in accordance with MIL-PRF-  
19500/115 for JAN, JANTX, JANTXV, and JANS with  
MQ, MX, MV, or MSP prefixes respectively for part  
numbers, e.g. MX1N3016BUR-1, MV1N3051BUR-1,  
etc.  
Metallurgically enhanced internal contact design for  
greater reliability and lower thermal resistance  
•
•
•
•
Nonsensitive to ESD  
Hermetically sealed glass package  
Specified capacitance (see Figure 2)  
•
•
Axial lead “thru-hole” DO-13 packages per JEDEC  
registration available as 1N3016B thru 1N3051B (see  
separate data sheet with MIL-PRF-19500/115  
qualification)  
Inherently radiation hard as described in Microsemi  
MicroNote 050  
RoHS Compliant devices available by adding “e3” suffix  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
•
•
•
Power dissipation at 25ºC: 1.5 watts (also see  
derating in Figure 1).  
•
•
CASE: Hermetically sealed glass MELF package  
TERMINALS: Tin-lead or RoHS compliant  
annealed matte-Tin plating solderable per MIL-  
STD-750, method 2026  
Operating and Storage temperature: -65ºC to  
+175ºC  
Thermal Resistance: 40 ºC/W junction to end cap,  
or 120ºC/W junction to ambient when mounted on  
FR4 PC board (1 oz Cu) with recommended  
footprint (see last page)  
•
POLARITY: Cathode indicated by band. Diode to  
be operated with the banded end positive with  
respect to the opposite end for Zener regulation  
•
•
MARKING: Cathode band only  
•
Steady-State Power: 1.50 watts at end-cap  
temperature TEC < 115oC, or 1.25 watts at TA = 25ºC  
when mounted on FR4 PC board and  
recommended footprint as described for thermal  
resistance (also see Figure 1)  
TAPE & REEL optional: Standard per EIA-481-1-A  
with 12 mm tape, 1500 per 7 inch reel or 5000 per  
13 inch reel (add “TR” suffix to part number)  
•
•
WEIGHT: 0.05 grams  
See package dimensions on last page  
•
•
Forward voltage @200 mA: 1.2 volts (maximum)  
Solder Temperatures: 260 ºC for 10 s (max)  
Copyright © 2006  
3-12-2006 REV D  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
123

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