Datasheet > 1MDL06-031-05T

1MDL06-031-05T

更新时间： 2024-11-27 12:26:51

品牌	Logo	应用领域
RMT		/
页数	文件大小	规格书
8页	2788K
描述
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper

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1MDL06-031-05T 数据手册

Thermoelectric Cooling Solutions

Performance Parameters

1MDL06-031-XXt

ΔT_maxQ_max

I_max

U_maxAC R

Type

Ohm mm

1MDL06-031-xxt (N=31)

1MDL06-031-03t

1MDL06-031-05t

1MDL06-031-07t

1MDL06-031-09t

1MDL06-031-12t

1MDL06-031-15t

11.93

7.63

5.61

4.43

3.37

2.72

5.2

3.3

2.4

1.9

1.4

1.1

0.55

0.89

1.23

1.57

2.08

2.59

0.9

1.1

1.3

1.5

1.8

2.1

3.9

Performance data are given for 300K, vacuum

Dimensions

Manufacturing options

A. TEC Assembly:

C. Ceramics Surface Options:

D. Thermistor (optional)

* 1. Solder SnSb (T_melt=230°C)

2. Solder AuSn (T_melt=280°C)

1. Blank ceramics (not metallized)

2. Metallized (Au plating)

Can be mounted to cold side

ceramics edge. Calibration is

available by request.

3. Metallized and pre-tinned with:

3.1 Solder 117 (In-Sn, T_melt=117°C)

3.2 Solder 138 (Sn-Bi, T_melt= 138°C)

3.3 Solder 143 (In-Ag, T_melt= 143°C)

B. Ceramics:

E. Terminal contacts

1. Blank, tinned Copper

2. Insulated Wires

* 1.Pure Al₂O₃(100%)

2.Alumina (Al₂O₃- 96%)

3.Aluminum Nitride (AlN)

* - used by default

3.4 Solder 157 (In, T_melt= 157°C)

3.5 Solder 183 (Pb-Sn, T_melt=183°C)

3.6 Optional (speciﬁed by Customer)

3. Insulated, color coded

46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru

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