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1MDL06-031-05AN05 PDF预览

1MDL06-031-05AN05

更新时间: 2024-11-27 12:26:51
品牌 Logo 应用领域
RMT /
页数 文件大小 规格书
8页 2794K
描述
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper

1MDL06-031-05AN05 数据手册

 浏览型号1MDL06-031-05AN05的Datasheet PDF文件第2页浏览型号1MDL06-031-05AN05的Datasheet PDF文件第3页浏览型号1MDL06-031-05AN05的Datasheet PDF文件第4页浏览型号1MDL06-031-05AN05的Datasheet PDF文件第5页浏览型号1MDL06-031-05AN05的Datasheet PDF文件第6页浏览型号1MDL06-031-05AN05的Datasheet PDF文件第7页 
Thermoelectric Cooling Solutions  
Performance Parameters  
1MDL06-031-xxAN05  
ΔTmax Qmax  
Imax  
A
Umax AC R  
H
Type  
K
W
V
Ohm mm  
1MDL06-031-xxAN05 (N=31)  
1MDL06-031-03AN05  
1MDL06-031-05AN05  
1MDL06-031-07AN05  
1MDL06-031-09AN05  
1MDL06-031-12AN05  
1MDL06-031-15AN05  
69  
72  
72  
73  
73  
73  
12.59  
7.89  
5.74  
4.52  
3.41  
2.74  
5.3  
3.3  
2.4  
1.9  
1.4  
1.1  
0.55  
0.89  
1.23  
1.57  
2.08  
2.59  
1.4  
1.6  
1.8  
2.0  
2.3  
2.6  
3.9  
Performance data are given for 300K, vacuum  
Dimensions  
Manufacturing options  
A. TEC Assembly:  
C. Ceramics Surface Options:  
D. Thermistor (optional)  
Can be mounted to cold side  
ceramics edge. Calibration is  
* 1. Solder SnSb (Tmelt=230°C)  
2. Solder AuSn (Tmelt=280°C)  
1. Blank ceramics (not metallized)  
2. Metallized (Au plating)  
available by request.  
3. Metallized and pre-tinned with:  
3.1 Solder 117 (In-Sn, Tmelt =117°C)  
3.2 Solder 138 (Sn-Bi, Tmelt = 138°C)  
3.3 Solder 143 (In-Ag, Tmelt = 143°C)  
B. Ceramics:  
E. Terminal contacts  
1. Blank, tinned Copper  
2. Insulated Wires  
1.Pure Al2O3(100%)  
2.Alumina (Al2O3- 96%)  
* 3.Aluminum Nitride (AlN)  
* - used by default  
3.4 Solder 157 (In, Tmelt = 157°C)  
3.5 Solder 183 (Pb-Sn, Tmelt =183°C)  
3.6 Optional (specified by Customer)  
3. Insulated, color coded  
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru  
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.  
Page 1 of 8  

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