1N5400G THRU 1N5408G
GLASS PASSIVATED SILICON RECTIFIER
Reverse Voltage - 50 to 1000 Volts Forward Current - 3.0 Amperes
FEATURES
DO-201AD
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
Construction utilizes void-free
molded plastic technique
Low reverse leakage
High forward surge current capability
High temperature soldering guaranteed:
260 C/10 seconds,0.375”(9.5mm) lead length,
5 lbs. (2.3kg) tension
Glass passivated chip junction
MECHANICAL DATA
Case: JEDEC DO-201AD molded plastic body
Terminals: Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.04 ounce, 1.10 grams
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
1N
1N
1N
1N
1N
1N
1N
1N
1N
SYMBOLS
UNITS
5408G
5400G 5401G 5402G 5403G 5404G 5405G 5406G 5407G
Maximum repetitive peak reverse voltage
Maximum RMS voltage
50 100 200 300 400 500 600 800 1000
35 70 140 210 280 350 420 560 700
V
V
V
VRRM
VRMS
VDC
50 100 200 300 400 500 600 800 1000
Maximum DC blocking voltage
Maximum average forward rectified current
0.375”(9.5mm) lead length at TA=75 C
Peak forward surge current
I(AV)
3.0
A
IFSM
150
1.1
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
A
V
VF
IR
Maximum instantaneous forward voltage at 3.0A
Maximum DC reverse current
at rated DC blocking voltage
TA=25 C
5.0
100
µ
A
TA=100 C
Typical junction capacitance (NOTE 1)
CJ
RθJA
pF
C/W
C
30.0
20.0
Typical thermal resistance (NOTE 2)
Operating junction and storage temperature range
TJ,TSTG
-55 to +150
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.Thermal resistance from junction to ambient at 0.375”(9.5mm)lead length,P.C.B. mounted
DN:T08B07A0
STAR SEA