TaNFilm® High Temperature
DIP and SIP Networks
IRC Advanced Film Division
Ceramic sandwich construction with
high temperature epoxy encapsulent
1900HT / 4700HT SERIES
· Inherent reliability
Sputtered tantalum
nitride with passivation
oxide layer
· Custom configurations available
· Bonded leads not susceptible to solder reflow problems
· Absolute tolerence to ±0.1% - ratio accuracy to ±0.05%
· Absolute TCR to ±25 ppm/°C - ratio tracking to ±5ppm/°C
Thermo-compression
bonded leads provide
exceptional reliability
The IRC 1900HT and 4700HT Series is the ultimate combination of precision performance, reliability, and long term stability in a low
profile,TaNFilm® DIP and SIP packages. The rugged welded lead construction combined with the inherent passivation characteristics
of tantalum nitride film insure superior continuous performance in high temperature applications over the installed life of the part.
Electrical Data
Rated Voltage
(not to exceed
rated power)
Package
Type
Ohmic
Range
Package Element
Temperature
Range
Size
Schematic
Power
Power
Isolated
Schematic A
100Ω to 100KΩ
1.00KΩ to 50KΩ
100Ω to 100KΩ
1.00KΩ to 50KΩ
50Ω to 50KΩ
14
1.12W
Bussed
Schematic B
DIP
0.08W
100V
Isolated
Schematic A
16
6
1.28W
0.24W
0.32W
Bussed
Schematic B
-55°C to +200°C
Isolated
Schematic G
Bussed
Schematic C
2.00KΩ to 25KΩ
50Ω to 50KΩ
SIP
0.08W
50V
Isolated
Schematic G
8
Bussed
Schematic C
2.00KΩ to 25KΩ
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
© IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
HT Series Issue November 2008 Sheet 1 of 3