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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 1888654-3 | MACOM |
获取价格 |
Solutions for AdvancedTCA, AdvancedTCA 300, MicroTCA, and AdvancedMC Standards |
|
| 1888654-4 | MACOM |
获取价格 |
Solutions for AdvancedTCA, AdvancedTCA 300, MicroTCA, and AdvancedMC Standards |
|
| 1888655-1 | MACOM |
获取价格 |
Solutions for AdvancedTCA, AdvancedTCA 300, MicroTCA, and AdvancedMC Standards |
|
| 1888655-2 | MACOM |
获取价格 |
Solutions for AdvancedTCA, AdvancedTCA 300, MicroTCA, and AdvancedMC Standards |
|
| 1888655-3 | MACOM |
获取价格 |
Solutions for AdvancedTCA, AdvancedTCA 300, MicroTCA, and AdvancedMC Standards |
|
| 1888655-4 | MACOM |
获取价格 |
Solutions for AdvancedTCA, AdvancedTCA 300, MicroTCA, and AdvancedMC Standards |
|
| 1888655-5 | MACOM |
获取价格 |
Solutions for AdvancedTCA, AdvancedTCA 300, MicroTCA, and AdvancedMC Standards |
|
| 1888658 | PHOENIX |
获取价格 |
Barrier Strip Terminal Block, |
|
| 1888674-1 | MACOM |
获取价格 |
Quick Reference Guide |
|
| 1888674-1 | TE |
获取价格 |
Quad Small Form- factor Pluggable (QSFP) Products |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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