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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 170071-1214 | MOLEX |
获取价格 |
Telecom and Datacom Connector |
|
| 1700712001 | MOLEX |
获取价格 |
zSFP Stacked Ganged Assembly with Elastomeric Gasket, 2-by-2 No Light Pipes, 80 Circuits |
|
| 1700712011 | MOLEX |
获取价格 |
zSFP Stacked Ganged Assembly with Elastomeric Gasket, 2-by-2 with 4 Light Pipes |
|
| 170071-2011 | MOLEX |
获取价格 |
Telecom and Datacom Connector |
|
| 1700712012 | MOLEX |
获取价格 |
zSFP Stacked Ganged Assembly with Elastomeric Gasket, 2-by-2 with Inner Light Pipes |
|
| 170071-2012 | MOLEX |
获取价格 |
Telecom and Datacom Connector |
|
| 1700712013 | MOLEX |
获取价格 |
zSFP Stacked Ganged Assembly with Elastomeric Gasket, 2-by-2 with Outer Down/Up |
|
| 170071-2013 | MOLEX |
获取价格 |
Telecom and Datacom Connector, |
|
| 1700714001 | MOLEX |
获取价格 |
zSFP Stacked Ganged Assembly with Elastomeric Gasket, 2-by-4 No Light Pipes, 160Circuits |
|
| 1700714011 | MOLEX |
获取价格 |
zSFP Stacked Ganged Assembly with Elastomeric Gasket, 2-by-4 with 4 Light Pipes |
|
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英特尔震撼发布：128核心256线程的至强6性能核处理器
SK海力士量产12层HBM3E，容量高达36GB
意法半导体传感器驱动Sphere，开启沉浸式电影新时代
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