是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 包装说明: | QCCN, LCC22,.3X.5 |
Reach Compliance Code: | compliant | 风险等级: | 5.92 |
最长访问时间: | 55 ns | I/O 类型: | SEPARATE |
JESD-30 代码: | R-XQCC-N22 | JESD-609代码: | e0 |
内存密度: | 65536 bit | 内存集成电路类型: | STANDARD SRAM |
内存宽度: | 1 | 湿度敏感等级: | 2A |
端子数量: | 22 | 字数: | 65536 words |
字数代码: | 64000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
组织: | 64KX1 | 输出特性: | 3-STATE |
封装主体材料: | CERAMIC | 封装代码: | QCCN |
封装等效代码: | LCC22,.3X.5 | 封装形状: | RECTANGULAR |
封装形式: | CHIP CARRIER | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | 250 | 电源: | 5 V |
认证状态: | Not Qualified | 筛选级别: | 38535Q/M;38534H;883B |
最大待机电流: | 0.009 A | 最小待机电流: | 4.5 V |
子类别: | SRAMs | 最大压摆率: | 0.07 mA |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | NO LEAD |
端子节距: | 1.27 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 30 | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
1600LMQB70 | FAIRCHILD | Standard SRAM, 64KX1, 70ns, CMOS, CQCC22, |
获取价格 |
|
1600MPW103HHVLO | RUBYCON | CAPACITOR, METALLIZED FILM, POLYESTER, 2000V, 0.01uF, THROUGH HOLE MOUNT, RADIAL LEADED |
获取价格 |
|
1600MPW103HHVS | RUBYCON | CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 1600V, 0.01uF, THROUGH HOLE MOUNT, RADIAL LEADE |
获取价格 |
|
1600MPW122KHVLO | RUBYCON | CAPACITOR, METALLIZED FILM, POLYESTER, 2000V, 0.0012uF, THROUGH HOLE MOUNT, RADIAL LEADED |
获取价格 |
|
1600MPW122KHVS | RUBYCON | CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 1600V, 0.0012uF, THROUGH HOLE MOUNT, RADIAL LEA |
获取价格 |
|
1600MPW222KHVLO | RUBYCON | CAPACITOR, METALLIZED FILM, POLYESTER, 2000V, 0.0022uF, THROUGH HOLE MOUNT, RADIAL LEADED |
获取价格 |