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143 PDF预览

143

更新时间: 2024-01-11 21:12:01
品牌 Logo 应用领域
TTELEC /
页数 文件大小 规格书
3页 122K
描述
Custom Commercial Modules

143 技术参数

是否Rohs认证: 不符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.64Is Samacsys:N
变压器类型:GENERAL PURPOSE AUDIO TRANSFORMERBase Number Matches:1

143 数据手册

 浏览型号143的Datasheet PDF文件第2页浏览型号143的Datasheet PDF文件第3页 
MODEL 143  
Custom Commercial  
Modules  
FEATURES  
IMPLEMENTATION  
BI has an experienced design team that provides  
customer assistance on new programs from the  
proposal/estimate phase through development and  
into production.  
• Low cost surface mount assembly  
• Chip on board capability  
• Reduced board size  
• Ceramic board  
During the proposal phase, a customer interface will  
be set up to develop and price alternate design  
approaches. During the development phase, a close  
working arrangement will be maintained through  
prototype samples and into production.  
• Integral thick film resistors  
• U.S. design & management  
• U.S. or offshore Assembly  
• Versatile lead configuration  
• Low profile outline  
Simply submit a circuit schematic, dimensional  
constraints, critical components and any special  
requirements to BI Marketing. BI will produce a sizing  
estimate and costing workup to meet your design  
goals.  
DESCRIPTION  
Whether you are upgrading your “through-hole” circuit  
board to surface mount or developing a new design, BI  
Technologies has the solution for you. BI commercial  
hybrids can be used as subassemblies on a  
motherboard, or they can encompass your entire  
circuit.  
Hybrid assemblies are being used in an increasing  
number of applications. BI commercial assemblies are  
circuit boards based on ceramic material rather than  
conventional polymer materials. In small to mid-sized  
assemblies, ceramic substrates offer price competitive  
solutions and many quality and design advantages.  
Resistors are directly screened onto the substrate and  
other components are typically surface mounted. Chip  
and wire attachment is available for components  
where required. A variety of lead frame configurations  
are available to create SIP’s, DIP’s, through hole, and  
surface mountable assemblies. Polymer encapsulation  
can be used to protect components and proprietary  
designs.  
COMMITMENT  
BI is committed to servicing your needs. BI has been a  
dominant force in the commercial and military hybrid  
microelectronics industry since its conception. Our  
reputation is built on over 25 years of proven reliability  
and quality. Program Management, engineering, and  
quality departments are located in Fullerton, California  
for ease of contact and interface. BI’s domestic  
location is your window to global facilities. BI  
Fullerton can draw on multiple factory locations,  
including Mexico, Scotland, Asia and Fullerton, to  
select the optimum resources for your assembly  
needs.  
7
Specifications subject to change without notice.  
Model 143  
7-5  

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