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1290

更新时间: 2024-09-17 06:24:39
品牌 Logo 应用领域
泰科 - TE 肖特基二极管
页数 文件大小 规格书
3页 56K
描述
SURMOUNTTM Low Barrier 0201 Footprint Silicon Schottky Diodes

1290 数据手册

 浏览型号1290的Datasheet PDF文件第2页浏览型号1290的Datasheet PDF文件第3页 
MA4E2501-1290 Series  
SURMOUNTTM Low Barrier  
0201 Footprint Silicon Schottky Diodes  
Rev. V1  
Features  
A
Extremely Low Parasitic Capitance and Inductance  
Extremely Small 0201 (600x300um) Footprint  
Surface Mountable in Microwave Circuits , No Wirebonds  
Required  
B
C
Rugged HMIC Construction with Polyimide Scratch Protection  
Reliable, Multilayer Metalization with a Diffusion  
Barrier, 100% Stabilization Bake (300°C, 16 hours)  
Lower Susceptibility to ESD Damage  
Description  
The MA4E2501L-1290 SurMountDiodes are Silicon Low  
Barrier Schottky Devices fabricated with the patented  
Heterolithic Microwave Integrated Circuit (HMIC) process.  
HMIC circuits consist of Silicon pedestals which form diodes or  
via conductors embedded in a glass dielectric, which acts as the  
low dispersion, microstrip transmission medium. The  
combination of silicon and glass allows HMIC devices to have  
excellent loss and power dissipation characteristics in a low  
profile, reliable device.  
D
E
F
G
The Surmount Schottky devices are excellent choices for circuits  
requiring the small parasitics of a beam lead device coupled with  
the superior mechanical performance of a chip. The SurMount  
structure employs very low resistance silicon vias to connect the  
Schottky contacts to the metalized mounting pads on the bottom  
surface of the chip. These devices are reliable, repeatable, and a  
lower cost performance solution to conventional devices. They  
have lower susceptibility to electrostatic discharge than  
conventional beam lead Schottky diodes.  
-
+
Cathode  
Anode  
Case Style 1290  
dim.  
in  
mm  
The multi-layer metalization employed in the fabrication of the  
Surmount Schottky junctions includes a platinum diffusion  
barrier, which permits all devices to be subjected to a 16-hour  
non-operating stabilization bake at 300°C.  
min. max. min. max.  
0.023 0.025 0.575 0.625  
0.011 0.013 0.275 0.325  
0.004 0.008 0.102 0.203  
0.006 0.008 0.150 0.200  
0.007 0.009 0.175 0.225  
0.006 0.008 0.150 0.200  
0.009 0.011 0.220 0.270  
A
B
C
D
E
F
The extremely small “ 0201 ” outline allows for Surface Mount  
placement and multi-functional polarity orientations.  
G
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions is considering for development. Performance is based on target specifications,  
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications  
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be  
available. Commitment to produce in volume is not guaranteed.  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
India Tel: +91.80.43537383 China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  

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