9
8
7
6
5
4
3
2
1
(2-0.55)
-DATE CODE-
example:
M 2 B 1 5 A 1
2
5
1
M-> Molex initial
2-> Year(2012)
12-15.1
(12-14.1)
(8.68)
B-> Month(November) 1, ...9, A, B, C
15-> Date(15th)
A-> Site initial(Ansan)
[microSIM CARD PIN-MAP]
*See Sheet3
For Detail
(8P Vs 6P)
DESCRIPTION
Vcc(Supply V)
RST(Reset)
8P
S1
6P
C1
24-1.35
(2.41)
1-> Manufacture line number
(2.4)
(8.6)
(2.2)
0.12
+0.15
+0.05
±
2.10
0.49
3
S2 C2
m-SD Contact
E
E
# 8 # 7 #6 #5 #4 #3 #2 #1
CLK(Clock)
Reserved
S3
S4
C3
--
G5
G4
GND
S5 C4
Shell Soldertails
(8-6.50)
Shell Soldertails
(8-0.55)
*******
Switch
5.85
1.7
Vpp(Program V)
S6
S7
C5
Switch Soldertail
(0.6)
Switch Soldertail
(6.05)
Contact Soldertails
(16-6.65)
Contact Soldertails
(16-0.40)
±
0.1
S/W
24-0.45
±0.1
C6 I/O
0.045
T8
T1
S8 --
Reserved
G3
GND
G1~G8
G6
(10.3)
6
NO PATTERN AREA
ALL SOCKET SPACES(HATCHING AREA)
WITHOUT SOLDER PATTERN
G2
T7
G7
[microSD CARD PIN-MAP]
#8
#7
#6
#5
T2
T3
DESCRIPTION
DAT2
CD/DAT32
PIN NO.
T1
T
6
Vacuum
Area
S8(--)
T5
(C4)S5
T4
T2
(0.15)
D
C
B
D
C
B
T3
CMD
S7(C6)
S3(C3)
S4(--)
(C5)S6
DD
T4
T5
T6
T7
V
(C2)S2
(C1)S1
m-SIM Contact
#2 #1
CLK
#4
#3
Vss(GND)
(0.95)
DAT0
DAT1
G1
G8
T8
CARD DETECTOR
S/W
(24-1.35)
(24-7.55)
SOCKET OUTLINE
PCB OUTLINE
(0.1)
4
mSD Card Center
mSIM Card
& Socket Center
±
0.1
1.2
(0.1)
RECOMMENDED PCB LAYOUT [FRONT VIEW]
[TOLERANCE : ±0.05]
±
0.12
13.2
+0.12
-0.05
☆12.15
mSIM Entrance of a Housing
+0.1
-0.08
☆9.82
mSD Entrance of a Housing
NOTES
1. MATERIALS: SEE TABLE
2. FINISHES: SEE TABLE
3. MATES WITH
±0.2
Pitch 1.1x7=7.7
-UPPER: microSD Card
-LOWER: microSIM(UICC) Card
4. PRODUCT SPECIFICATIONS: PS-104642-001
5. PACKING SPECIFICATIONS: SPK-104642-002
6. COPLANARITY OF SOLDER TAILS:
±
±
0.2
0.2
2.25
7.59
ISOMETRIC
(SCALE 4/1)
(14.1)
0.08mm MAX. BEFORE & AFTER 250
°
C REFLOW 2TIMES
7.REFERENCE CARD DIMENSIONS ARE WITH STANDARD DIMENSION CARD
8.CUSTOMER'S CTF DIMENSION(☆) IS EQUAL TO MOLEX MAJOR QUALITY SYMBOL(
[Circuit diagram for Detection Switch of microSD card]
Card insertion condition Card detect-switch
SMD ONLY
104642-1610
1046421610
)
Circuit
Switch terminal
SOLDER TYPE
PART (ORDER) NO.
MATERIAL NO.
mSD #6pin
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
QUALITY
SYMBOLS
Open
Close
Without Card
Card insertion
DIMENSION UNITS
SCALE
GENERAL
TOLERANCES
(UNLESS SPECIFIED)
MM
5:1
=
0
FINISHES
NO.
1
PARTS NAME
MATERIALS
DRWN BY
DATE
=
0
CONTACT mSIM: GOLD 0.05㎛ MIN. OVER Pd-Ni 0.3㎛ MIN.
CONTACT mSD: GOLD 0.05㎛ MIN. Pd-Ni 0.2㎛ MIN.
SWITCH: GOLD 0.1㎛ MIN. (Pd-Ni IS PALLADIUM NICKEL)
SOLDERS: GOLD 0.05㎛ MIN.
ANGULAR TOL ± 1.0
°
YHJUNG02
CHK'D BY
2016/04/14
2016/08/29
CONTACT TERMINAL COPPER ALLOY
(16P)
COMBO 2.10H PULLER TYPE
MICROSD/MICROSIM 8P/8P WITH S/W
4 PLACES
3 PLACES
2 PLACES
1 PLACE
±
±
±
±
±
=
0
DATE
DATE
0.12
0.12
0.15
0.15
BASE: NICKEL 1.27 MIN.
=
2
3
SWITCH TERMINAL
microSD SHELL
PHOSPHOR BRONZE
STAINLESS STEEL
4
SHCHU
APPR BY
A
A
BRIGHT NICKEL 1.27㎛ MIN.
BRIGHT NICKEL 1.27㎛ MIN.
NATURAL(IVORY) COLOR, UL94V-0
=
0
PRODUCT CUSTOMER DRAWING
YSKIM02
2016/09/01
SERIES
MATERIAL NUMBER
CUSTOMER
4
microSIM SHELL
STAINLESS STEEL
=
0
0 PLACES
DRAWING SIZE
THIRD ANGLE PROJECTION
GENERAL
5
6
HOUSING
LIQUID CRYSTAL POLYMER
104642
SEE TABLE
=
0
DRAFT WHERE APPLICABLE
MUST REMAIN
DOCUMENT NUMBER
DOC TYPE DOC PART SHEET NUMBER
EJECT-PULLER
STAINLESS STEEL
NONE
A3
C
WITHIN DIMENSIONS
=
0
A4
1 OF 3
1046421610
PSD
000
RELEASE STATUS
FORMAT: master-tb-prod-A3
REVISION: G
P1
RELEASE DATE 01.09.2016
23:51:41
9
8
7
6
5
4
3
2
1
DATE: 2015/12/14
5秒后页面跳转
全球首块英伟达H200交付 黄仁勋“送货上门”
常用8脚开关电源芯片型号大全
74HC04芯片引脚图及功能、应用电路图讲解
CR6842芯片参数、引脚配置、应用电路图详解
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
技术参数
数据手册
如果您发现信息不准确，
