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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 1-1775470-6 | MACOM |
获取价格 |
HPI CONN., 2.0MM PITCH, V/T, SMT TYPE |
|
| 1-1775529-1 | MACOM |
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Power Connectors & Interconnection Systems |
|
| 1-1775529-2 | MACOM |
获取价格 |
Power Connectors & Interconnection Systems |
|
| 1-1775855-1 | MACOM |
获取价格 |
MODULAR JACK, RJ45, STACKED OVER USB CONN. |
|
| 1-1775862-1 | ETC |
获取价格 |
QUICK REFERENCE GUIDE |
|
| 1-1775862-2 | ETC |
获取价格 |
QUICK REFERENCE GUIDE |
|
| 1-1776038-0 | TE |
获取价格 |
TERMINAL BLOCK HEADER ASSEMBLY, 90 DEGREE, CLOSED ENDS, HIGH TEMPERATURE, 5.08mm PITCH |
|
| 1-1776038-1 | TE |
获取价格 |
TERMINAL BLOCK HEADER ASSEMBLY, 90 DEGREE, CLOSED ENDS, HIGH TEMPERATURE, 5.08mm PITCH |
|
| 1-1776038-2 | TE |
获取价格 |
TERMINAL BLOCK HEADER ASSEMBLY, 90 DEGREE, CLOSED ENDS, HIGH TEMPERATURE, 5.08mm PITCH |
|
| 1-1776038-3 | TE |
获取价格 |
TERMINAL BLOCK HEADER ASSEMBLY, 90 DEGREE, CLOSED ENDS, HIGH TEMPERATURE, 5.08mm PITCH |
|
解析光耦仿真器：升级光耦合器技术的必要性
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国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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