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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 094240-3818 | MOLEX |
获取价格 |
2.54mm (.100") Pitch, MOX Header, 3.50mm (.137") Grid, Through Hole, PBT, Vertical, 18 Cir |
|
| 0942411006 | MOLEX |
获取价格 |
4.50 (0.177") Header, 6 Circuits |
|
| 0942422118 | MOLEX |
获取价格 |
2.54mm (.100") Pitch, MOX Header, 3.50mm (.137") Grid, Through Hole |
|
| 0942422318 | MOLEX |
获取价格 |
2.54mm (.100") Pitch, MOX Header, 2.54mm (.100") Grid, Through Hole, PCT, Vertical, 18 Cir |
|
| 0942460012 | MOLEX |
获取价格 |
2.54mm (.100") Pitch, MOX Header, 2.54mm (.100") Grid, Through Hole |
|
| 0942460112 | MOLEX |
获取价格 |
2.54mm (.100") Pitch, MOX Header, 2.54mm (.100") Grid, Through Hole, PCT, Vertical, 12 Cir |
|
| 0942UEM011 | LUMBERG |
获取价格 |
Connectors & Components for Automation Technology |
|
| 0942UEM012 | LUMBERG |
获取价格 |
Connectors & Components for Automation Technology |
|
| 0942UEM013 | LUMBERG |
获取价格 |
Connectors & Components for Automation Technology |
|
| 0942UEM014 | LUMBERG |
获取价格 |
Connectors & Components for Automation Technology |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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