MAXIMUM SOLUTIONS
Mill-Max Expands its Line of Receptacles with Organic Fibre Plug®
Solder Barrier -- 14 Styles Offered, Tape & Reel Packaged
Mill-Max’s organic fibre plug (OFP®) solder
barrier receptacles are discrete sockets for
through-hole soldering into printed circuit
boards. These open bottom receptacles are
fitted with organic fibre plugs to prevent
solder, paste or flux from contaminating
the internal contact during the placing and
soldering process. When the device/mating
lead is plugged into the receptacle the OFP® is
knocked out allowing the mating lead to pass
through the fingers of the internal contact
and make a reliable electrical connection.
14 sizes/styles are now available, 13 have stan-
dard tape & reel packaging. The advantage of tape & reel packaging for these receptacles is it permits through-hole
components to be placed simultaneously with surface mount parts on pick-’n-place assembly lines – eliminating the
need to hand place the receptacles in an additional manufacturing step. The OFP® barrier permits the sockets to be
vacuum picked from the tape prior to placement in a hole in the circuit board.
The knock-out-bottom feature enables these sockets to be made relatively short compared to many similar recep-
tacles. The reduced length provides two advantages: the receptacles can stand upright and stable in a carrier tape
pocket and the protrusion through the PCB is minimal — especially important when working with SMT boards. The
open bottom receptacle design eliminates the need to trim long device leads that would otherwise bottom out in
a closed receptacle design and also makes them ideal for low profile board stacking applications via the ability to
pass through.
The OFP® parts are available as discrete receptacles and can be supplied in bulk or on carrier tape per EIA-481 for
industry standard pick and place machines. All Mill-Max receptacles use a precision-machined brass housing with a
press-fit beryllium copper “multi-finger” contact.
(Intrusive reflow (also called “pin-in-paste”) is a technique of using conventional through-hole components in a reflow soldering process. The
receptacles are placed into plated-through holes (PTH) in the circuit board (solder paste has previously been screen printed on pads adjacent
to the holes) and the board is reflowed in the same pass as other SMT components. Solder will fill the PTH and achieve solder joints as reliable
as wave soldering. The OFP® barrier prevents solder paste from being picked-up inside the contact during pick ‘n place assembly. “Overprinting”
paste on the solder mask can be used to adjust the volume of paste required to fill each hole.)
Visit www.mill-max.com/PR626 for more information.
(7/13 -- 626)
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, Oyster Bay, NY 11771
516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
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